Matches for your search: "fan-out wafer level packaging "
YES, a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences, and AR/VR applications, today announced that its TersOnus TGV tool was released for panel-level manufacturing. This system will be used to support the growth of advanced heterogeneous packaging for artificial intelligence chips that enable large language models....
MILPITAS, Calif. — May 8, 2024 — SEMI today released the report A Rising Tide: Building a Climate-Resilient Semiconductor Value Chain that spotlights the maturity of the semiconductor value chain as it strives toward greater climate resilience and develops climate risk mitigation strategies. Led by the SEMI Sustainability Initiative Environmental Risk Mitigation and Reporting (ERMR)...
The 2019 3D InCites Awards vote was a nail-biter right up until the end. While some categories seemed almost predictable from start, others were neck-and-neck, with the front runner changing on a daily basis. What was most exciting to me, however, was how many new participants we had, and how...
“2.5D and 3D stacking technologies are the only solution that meet the required performance of applications like AI[1] and datacenter as for today”, confirms Mario Ibrahim, Technology & Market Analyst from Yole Développement (Yole). Stacking technologies are used in a variety of hardware, including 3D stacked memory, GPU[2], FPGA[3], and...
Wilmington, Mass. (September 12, 2017)—Rudolph Technologies, Inc. (NYSE: RTEC) announced today that its Firefly™ Inspection Systems, shipped to fulfill previously announced orders from multiple semiconductor manufacturers, are now qualified for production. The Firefly Inspection Systems provide high-resolution visual and non-visual inspection in a variety of advanced packaging processes, including fan-out...
Automotive electronics, with the Holy Grail being fully autonomous vehicles, is currently being touted as one of the biggest growth drivers for the semiconductor industry. So much so, that every event I’ve attended so far this year has featured sessions, presentations, keynotes, and panel discussions espousing the benefits of autonomous...
According to TechSearch International, we can expect to see 87% CAGR for fan-out wafer-level packages (FOWLP) over the coming 3 years. This demand is driven by a combination of several factors. Primarily there is great potential for the advanced capabilities of FOWLP to provide cost-effective system-level solutions for mid- to...
“We are at a crossroads. Current chip design is nearing its capacity. The time, expense, and effort needed to make major inroads have grown exponentially. We need a transformational shift in how our systems are designed and put together. Moore’s law is no longer about scaling a chip, but about...
Dear Chip and System-level Designers, Allow me to introduce myself. My name is Françoise von Trapp, and I am known in the semiconductor industry as “The Queen of 3D”. This is because I have held a deep interest in 3D integration technologies, and have devoted the past 7+ years to...
With two 3D focused keynotes and a 3D panel discussion, 3D Thursday was ripe for the tweeting. The sound bites were coming fast and furious from Subu Iyer, IBM Fellow, and Rao Tummala, director of Georgia Tech’s 3D Packaging Research Center. Additionally, the 3D Panel featuring both Iyer and Tummala,...
