Matches for your search: "fan-out wafer level packaging "
When I worked for Advanced Packaging magazine in the early 2000s, we sometimes got pitches from companies that made cardboard boxes or foam cushioning materials. Their spokespeople obviously had not read the magazine or looked beyond the word “packaging” in the title. We ignored those pitches. However, many levels of...
Onshoring SK hynix HBM Multiple reports indicate that SK Hynix is poised to announce its first major U.S. investment: A $15B+ advanced packaging facility. SK hynix is reportedly picking Indiana as its geographic site, but has Arizona available as a second choice, according to those close to the negotiations. While...
Sorry for the disruption of the chronological flow of my recent blogs, but before I move on to the July coverage of the much-anticipated IMAPS “ONSHORING” conference, I wanted to continue covering a few of the papers from the 2023 IMAPS Device Packaging Workshop, which took place in March. As...
“2.5D and 3D stacking technologies are the only solution that meet the required performance of applications like AI[1] and datacenter as for today”, confirms Mario Ibrahim, Technology & Market Analyst from Yole Développement (Yole). Stacking technologies are used in a variety of hardware, including 3D stacked memory, GPU[2], FPGA[3], and...
Wilmington, Mass. (September 12, 2017)—Rudolph Technologies, Inc. (NYSE: RTEC) announced today that its Firefly™ Inspection Systems, shipped to fulfill previously announced orders from multiple semiconductor manufacturers, are now qualified for production. The Firefly Inspection Systems provide high-resolution visual and non-visual inspection in a variety of advanced packaging processes, including fan-out...
Philadelphia PA, USA, July 10, 2017 – EMD Performance Materials, a leading science, and technology company, today announced its portfolio of materials solutions for advanced semiconductor manufacturing. Megatrends represented by big data, automotive electronics, IoT, and an increased interest in green assembly, is expanding the need for advanced semiconductor processing and...
According to TechSearch International, we can expect to see 87% CAGR for fan-out wafer-level packages (FOWLP) over the coming 3 years. This demand is driven by a combination of several factors. Primarily there is great potential for the advanced capabilities of FOWLP to provide cost-effective system-level solutions for mid- to...
Unlike the traditional system-on-chip (SoC) design process, which has fully qualified verification methods embodied in the form of process design kits (PDKs), chip design companies and assembly houses have no integrated circuit (IC) package co-design sign-off verification process to help ensure that an IC package will meet manufacturability and performance...
The semiconductor industry’s march toward broader 3D IC integration marked an important milestone this week at the 2013 Electronic Components & Technology Conference (ECTC), with the report of an advanced new temporary bonding solution for 3D Through Silicon Via (TSV) semiconductor packaging. The breakthrough was unveiled during ECTC’s 3D Materials...
So I’m sitting here back at my desk, sifting through my pile of notes from this week’s adventures at the 2010 International Wafer Level Packaging Conference in Santa Clara, CA, trying to figure out what to write about first. Between chairing sessions, conducting interviews, attending keynotes and panels, and just...
