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The foundry world has been big news in the past few weeks. TSMC started up the Kumamoto Fab, Japan’s leading-edge semiconductor technology center, partnering with Tenstorrent on RISC-V and chiplets to be manufactured at Rapidus. The biggest non-surprise news flash was the roll-out of Intel’s Foundry Direct Connect, which they...
MILPITAS, Calif. — October 25, 2022 — Worldwide silicon wafer shipments reached a new record of 3,741 million square inches (MSI) in the third quarter of 2022, increasing 1.0% quarter-over-quarter and growing 2.5% from the 3,649 MSI recorded during the same quarter last year, the SEMI Silicon Manufacturers Group (SMG)...
This week we continue our look at ECTC 2020. imec and SPTS Collaborate on Nano-TSV Processes As part of our IFTLE theme of advanced packaging and interconnect going submicron, let’s look at the imec (long renowned for both their front end and back end work) presentation “Extreme Wafer Thinning and...
At the recent IMAPS Device Packaging Conference, March 5-7, 2019 in Fountain Hills AZ, Benedetto Vigna, president of the ST Micro Analog, MEMS and Sensors Group, discussed the company’s presence in the sensor technology market. The vast assortment of sensor and actuator functions have recently been defined by Yole Developpement...
Power devices are experiencing growth driven by demand in a variety of areas. TechSearch International projects a 4.3% growth in overall leadframe package shipments from 2017 to 2021 for power device packaging, with stronger growth projected for Cu clip packages. Applications including energy generation and infrastructure, electric and hybrid vehicles,...
FLORIAN, Austria, July 11, 2016—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the EVG®50 automated metrology system. Designed to support the increasingly stringent manufacturing requirements for advanced packaging, MEMS and photonics applications, the EVG50 performs high-resolution non-destructive...
Wilmington, Mass.—Rudolph Technologies, Inc. (NYSE: RTEC) is pleased to announce the availability of new, high-speed 3D metrology on its flagship NSX® Series, a highly-flexible inspection and measurement platform for process development and control of die-level interconnects. Already in use by multiple customers worldwide, the NSX Series with high-speed 3D metrology is...
Garching, October 7, 2014 – SUSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor and related markets, has launched its next-generation semi-automated permanent wafer bonder today. The SB6/8 Gen2 Wafer Bonder is SUSS MicroTec’s state-of-the-art universal permanent wafer bonding system that handles wafers up to 200 mm and supports...
CMOS image sensors (CIS) have often been heralded as the first 3D devices in volume manufacturing. However, this is not really the case. Shellcase MVP, the first generation of CIS that used through silicon vias (TSVs) to form interconnects was still a 2D device. (Remember, TSV is not always synonymous with 3D)....
Ladies and Gentlemen of the semiconductor industry, we have a new acronym to add to 3D integration lexicon and its name is 3D SoC (aka: 3D system on a chip, or 3D system partitioning, or mixed node integration – take your pick). Whatever the moniker, it looks like THIS is...
