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As the semiconductor industry continues to experience a surge of innovation, companies worldwide are collaborating to propel technology forward while also addressing sustainability issues and investing in STEM education. From pioneering product debuts and events to strategic alliances and efforts in workforce development, our members had lots of news to...
In IFTLE 517, we discussed the upcoming standardization in the chiplet world with the passage of the Universal Chiplet Interconnect Express (UCIe) by member companies shown in Figure 1. With this powerhouse group agreed to all be on the same page, will anyone else go off on their own? IFTLE doubts...
With the dawn of chiplet integration, advanced chip manufacturing and advanced packaging technologies are more complex than ever. Dies are being integrated from different wafers, and yield management is tricky. It requires a combination of both electrical test and optical measurement – or metrology. Even more, it requires hybrid metrology...
Aiming at facilitating mutual engagement, the SEMI Packaging Technology Seminar will foster collaboration among semiconductor packaging, assembly, test manufacturing, and design experts, to collectively strengthen the semiconductor back-end industry in Europe. This is a great opportunity to meet with members of the SEMI integrated Packaging, Assembly and Test Technology Community (SiPAT-TC), pioneered by the European chapter (ESiPAT-TC) established in 2016....
Power devices are experiencing growth driven by demand in a variety of areas. TechSearch International projects a 4.3% growth in overall leadframe package shipments from 2017 to 2021 for power device packaging, with stronger growth projected for Cu clip packages. Applications including energy generation and infrastructure, electric and hybrid vehicles,...
Wilmington, Mass.—Rudolph Technologies, Inc. (NYSE: RTEC) is pleased to announce the availability of new, high-speed 3D metrology on its flagship NSX® Series, a highly-flexible inspection and measurement platform for process development and control of die-level interconnects. Already in use by multiple customers worldwide, the NSX Series with high-speed 3D metrology is...
Allentown, Pa., January 29, 2015 – Akrion Systems was well represented exhibiting at the 2015 European 3D TSV Summit earlier this month, as the company intensifies its focus on 3D TSV Advanced Packaging. The company displayed and discussed its unique hardware and process technologies that reduce the cost of critical processes in...
Ask any market researcher or business development executive at a major semiconductor manufacturing company; predicting exactly when the 3D integration market is going to take hold and fly is a tricky business, because there are so many elements to consider. During this year’s European 3D TSV Summit pre-conference market briefing,...
New this year at SEMICON West, and just introduced to the program late last week, the Expert TechHUBs will help attendees find answers to specific semiconductor test and packaging questions. Meet with industry experts in an informal discussion group on the North Hall show floor at TechHUB Test or in...
The semiconductor industry’s march toward broader 3D IC integration marked an important milestone this week at the 2013 Electronic Components & Technology Conference (ECTC), with the report of an advanced new temporary bonding solution for 3D Through Silicon Via (TSV) semiconductor packaging. The breakthrough was unveiled during ECTC’s 3D Materials...
