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Executive Summary: Innovative, High Throughput Surface Metrology Hybrid bonding is enabling the next generation of advanced packaging in the semiconductor industry. As hybrid bonding occurs at the molecular level, it requires careful control of the surface topography for high yield. At Adeia, we developed new methods to improve both throughput...
Successful full-system die-to-wafer transfer at EVG’s Heterogeneous Integration Competence Center™ demonstrates an important step forward in process maturity EV Group (EVG), a leading provider of wafer bonding and lithography equipment for the MEMS, nanotechnology, and semiconductor markets, today announced it has achieved a major breakthrough in die-to-wafer (D2W) fusion and...
ERS electronic, the industry leader in the market of thermal management solutions for semiconductor manufacturing, has developed a temperature calibration device that allows automatic and highly accurate measurements below 30mK in the actual probing area. The patent-pending device, aptly named ProbeSense™, consists of a temperature sensor, which is mounted in...
A Conversation with the Xperi Hybrid Bonding Team In the world of heterogeneous integration, hybrid bonding — and in particular, Direct Bond Interconnect (DBI®) is quickly becoming the preferred permanent bonding path for forming high-density interconnects in a multitude of applications, from image sensors and MEMS devices, and most recently...
I first met Dr. Thomas Fries, Founder, and CEO of FRT, The Art of Metrology in 2016 at SEMI Europe’s 3D Summit in Grenoble. Fries became a big fan of 3D InCites, following us on social media, and sharing our content. Over the next few years, Fries and the team...
Materials have a major impact on reliability, performance, cost and other key parameters of electronic solutions. SEMI’s recent Strategic Materials Conference (SMC 2019) brought materials suppliers and their customers together to discuss progress made in these areas. They also addressed how to solve the increasingly divergent and complex challenges current...
Requirements for interconnect pitches of 20µm and below is expected to be the norm in the future. Since typical solder bump technology is not expected to be able to meet those requirements, many companies have been examining Cu-to-Cu direct bonding. Cu-to-Cu bonding can be achieved through one of two ways:...
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it is celebrating the 20th anniversary of its wholly owned subsidiary in Japan, EV Group Japan KK. Established in August 1997 in Yokohama, EV Group Japan has since...
ST. FLORIAN, Austria – Feb. 5, 2016 – EV Group (EVG), an industry-leading supplier of wafer-bonding, lithography/nanoimprint lithography (NIL), metrology, photoresist coating, cleaning and inspection equipment, today announced its participation in the 3D integration consortium of IRT Nanoelec, which is headed by CEA-Leti. EVG joins Leti, STMicroelectronics and Mentor Graphics...
The semiconductor industry hasn’t adopted 3D ICs as quickly as many in the industry expected. There are some barriers that perhaps have kept the cost/benefit analysis stuck in the ‘scaling’ camp rather than moving it to the ‘3D’ camp. However, many companies are preparing for the move to 2.5D and...
