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The foundry world has been big news in the past few weeks. TSMC started up the Kumamoto Fab, Japan’s leading-edge semiconductor technology center, partnering with Tenstorrent on RISC-V and chiplets to be manufactured at Rapidus. The biggest non-surprise news flash was the roll-out of Intel’s Foundry Direct Connect, which they...
Sorry for the disruption of the chronological flow of my recent blogs, but before I move on to the July coverage of the much-anticipated IMAPS “ONSHORING” conference, I wanted to continue covering a few of the papers from the 2023 IMAPS Device Packaging Workshop, which took place in March. As...
CHIPS Announces Details on Funding Opportunity Timing The Department of Commerce (DoC) has announced details regarding funding opportunities and application processes. In late February, the DoC plans to release a Notice of Funding Opportunity for commercial leading-edge, current, and mature node fabrication facilities. This includes both “front-end” semiconductor manufacturers and...
Plainview, N.Y. — Veeco Instruments Inc. (NASDAQ: VECO) today announced that a world leading semiconductor supplier has qualified Veeco’s WaferStorm® Wet Processing System for advanced packaging applications that will support next generation high bandwidth memory (HBM). The customer also operates Veeco’s AP300 Lithography Systems for advanced packaging production used to meet demand...
LAYERS 5, from Evatec, is your guide to all the latest thin-film technology news across advanced packaging, semiconductor, 0ptoelectronics, and photonics. Read about developments at Evatec Learn about changes in our capabilities and processes that support our customers better for the future. Advanced Packaging Read contributions from guest authors SEMCO...
PROPHESEE Joins IRT Nanoelec 3D Integration Program Will Work with CEA-Leti, STMicroelectronics, Mentor, EVG, and SET to Develop New 3D Event-Based Vision System GRENOBLE, France – Oct. 14, 2019 – PROPHESEE, the inventor of the world’s most advanced neuromorphic vision systems, joins the IRT Nanoelec consortium to help broaden the...
At the recent IMAPS Device Packaging Conference, March 5-7, 2019 in Fountain Hills AZ, Benedetto Vigna, president of the ST Micro Analog, MEMS and Sensors Group, discussed the company’s presence in the sensor technology market. The vast assortment of sensor and actuator functions have recently been defined by Yole Developpement...
Hsinchu, Taiwan – May 8, 2018 – UnitySC, a leader in advanced inspection and metrology solutions, today announced the opening of its Asia subsidiary, Unity Semiconductor Limited Company (UnitySC Asia). The entity was established to deliver enhanced customer support for UnitySC’s growing installed base of inspection and metrology tools throughout...
Garching, October 7, 2014 – SUSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor and related markets, has launched its next-generation semi-automated permanent wafer bonder today. The SB6/8 Gen2 Wafer Bonder is SUSS MicroTec’s state-of-the-art universal permanent wafer bonding system that handles wafers up to 200 mm and supports...
I know where many of the optimistic people in the semiconductor industry were today; giving presentations at the Global Business Council of IMAPS in Scottsdale AZ. The official theme of the day: Supply Chain Development for 3D Packaging, but I picked up on a subtheme, which was how to leverage...
