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In Part 4 of my coverage of the IMAPS Onshoring Workshop, we look at how government agency roles impact onshoring microelectronics. Office of Industrial-Based Policy Adele Ratcliff, Director of the Innovation Capability and Modernization Office discussed Manufacturing Capability Expansion and Investment Prioritization (MCEIP). The mission of the Office of Industrial-Based...
News you may not have seen this month from our community members. Along with some upcoming participation to keep an eye on. Onto Innovation announced over $100 Million in orders for systems supporting advanced packaging for AI. Its Dragonfly® G3 sub-micron inspection and metrology system supports production of AI chiplet packages....
Advanced Packaging’s Growth in AI TechSearch International’s latest analysis examines the demand for packages used in AI. As the industry enters the AI era, successful hardware deployment requires a supply of silicon interposers, or alternatives such as redistribution layer (RDL) structures and advanced laminates, to support high density. With the...
System-on-Chip (SoC) integrates ICs (by reducing the feature size) with different functions such as central processing unit (CPU ), graphic processing unit (GPU ), memory, etc. into a single chip for the system or subsystem. Unfortunately, it is more and more difficult and costly to reduce the feature size (to...
ANDOVER, Mass., April 19, 2022 (GLOBE NEWSWIRE) — Mercury Systems, Inc. (NASDAQ: MRCY, www.mrcy.com), a leader in trusted, secure mission-critical technologies for aerospace and defense, announced it has been selected to provide trusted and secure advanced packaging for the Office of the Undersecretary of Defense for Research and Engineering’s (OUSD...
Additive manufacturing defines new boundaries for 3D electronic packaging, determined by new exceptional materials, new 3D cavity structures and the everlasting drive for lower cost of manufacturing. Additive manufacturing is a complex process by which products are constructed layer by layer using a 3D-printable set of materials such as photopolymers,...
Rudolph Technologies, Inc. (NYSE: RTEC) today announced the immediate availability of its new JetStep® lithography systems for advanced packaging processes on wafer and panel formats. The JetStep systems incorporate an option for a new, proprietary submicron lens design, as well as up to 25% increased productivity over the previous JetStep...
A new book on 2.5D and 3D integration, written by Riko Radojcic and published by Springer, will soon be available. The book addresses the current status of More-than-Moore system-in-package (SiP) technologies and explores the technical and business tradeoffs for deploying these options in high volume commercial IC products. We’re pleased...
The era of “More than Moore” was alive and well in 2016 as the semiconductor industry witnessed many new developments in advanced packaging. Among these was the production of the first hybrid bonded image sensor, which enables high-performance image processing as well as on-sensor memory to provide faster extraction and...
In addition to attending the panel and plenary sessions at ECTC 2016, which took place May 31-June 3, 2016, I also spent a good deal of time talking to industry suppliers to get updates on their latest accomplishments that will impact the future of advanced semiconductor packaging, including interposer integration...
