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Executive Summary: Innovative, High Throughput Surface Metrology Hybrid bonding is enabling the next generation of advanced packaging in the semiconductor industry. As hybrid bonding occurs at the molecular level, it requires careful control of the surface topography for high yield. At Adeia, we developed new methods to improve both throughput...
Fast-growing microelectronics company to use industry-leading Solstice system for both electroplating and surface preparation in manufacturing of its Ideal Switch® KALISPELL, Mont. – July 12, 2023 – ClassOne Technology, a leading global provider of advanced electroplating and wet processing tools for microelectronics manufacturing, today announced it has secured an order...
Successful full-system die-to-wafer transfer at EVG’s Heterogeneous Integration Competence Center™ demonstrates an important step forward in process maturity EV Group (EVG), a leading provider of wafer bonding and lithography equipment for the MEMS, nanotechnology, and semiconductor markets, today announced it has achieved a major breakthrough in die-to-wafer (D2W) fusion and...
A Conversation with the Xperi Hybrid Bonding Team In the world of heterogeneous integration, hybrid bonding — and in particular, Direct Bond Interconnect (DBI®) is quickly becoming the preferred permanent bonding path for forming high-density interconnects in a multitude of applications, from image sensors and MEMS devices, and most recently...
Requirements for interconnect pitches of 20µm and below is expected to be the norm in the future. Since typical solder bump technology is not expected to be able to meet those requirements, many companies have been examining Cu-to-Cu direct bonding. Cu-to-Cu bonding can be achieved through one of two ways:...
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it is celebrating the 20th anniversary of its wholly owned subsidiary in Japan, EV Group Japan KK. Established in August 1997 in Yokohama, EV Group Japan has since...
Last Tuesday, April 7, was another important day for Silicon Valley. TSMC 2015 Technology Symposium celebrated 21 years of holding this annual event to update TSMC’s loyal customers and win new ones. Rick Cassidy, President TSMC North America, opened the symposium with a long list of impressive numbers about TSMC and put them into...
Want to know how to torture a journalist? Invite them to present at a conference but ask them to sign an NDA so they can’t write about it! However, I can say this much: the 3D Program is alive and well at IBM. From IBM Fellow, Subramanian Iyer, I learned...
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it has introduced a new equipment platform, dubbed the XT Frame, that extends process throughput and tool functionality for virtually all of its current volume-manufacturing product offerings. Specifically designed...
Top university selects EVG systems on strength of flexible technology, local service and support ST. FLORIAN, Austria, September 23, 2010 – EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it has shipped an EVG520IS semi-automated wafer bonding...
