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As advanced interconnect and advanced packaging processes take the helm to drive advancements in next generation semiconductor devices, innovation and collaboration across the microelectronics supply chain becomes more important than ever. So, when the 3D InCites Member Advisory Board reviewed this year’s finalists for the 2025 3D InCites Technology Enablement...
Koh Young, the global leader in True 3D measurement-based inspection and metrology solutions, announced its partnership with NTV USA (NexTex Ventures, LLC) to bring its proven inspection technologies to the semiconductor industry. With more than 24,000 systems installed worldwide, Koh Young has earned its reputation for innovation, accuracy, and reliability...
At this year’s IEEE International Electron Device Meeting, [IEDM] (December in San Francisco) SK hynix gave an interesting look at “Advanced Packaging Technology in Memory Applications for Future Generative AI Era”. [Generative AI creates new content through the use of machine learning models such as generative adversarial networks. Such frameworks...
Cadence, ASE Group, and Chung Yuan Christian University (CYCU) announced collaboration on an education and training program to cultivate talent for 3D-IC Design. Cadence collaborates with universities on system packaging education and talent development through the Cadence Academic Network program, which provides students with access to Cadence advanced IC packaging...
I wanted this blog to cover the recent whitepaper by Siemens’ EDA division on chiplet model standardization, and it will, but first I need to go over some introductory material on chiplets, and specifically, chiplet definition. Let me explain why. As part of the work that I do with the...
Finishing up our coverage of the 2021 IEEE 3DIC conference, we take a closer look at glass embedding, 3D stacked packaging for retinal prosthesis, and the chiplet design exchange. Georgia Tech – Glass Embedding Madhavan Swaminathan, who has replaced Rao Tummala as the Director of the GaTech Packaging Research Center...
The Great Miniaturization … SEMI/MEPTEC Conference Nov 10 & 11, continued from Part 1. Wednesday morning started with a IC packaging session focused on my favorite subject: Multi-die Integration. Trevor Yancey, who recently joined Jan Vardaman at TechSearch International, talked about the IoT and gave an example for how the...
An interesting take-away from the keynote talk delivered by Brandon Prior, Prismark Partners, at this year’s IMAPS International Device Packaging Conference, held March 11-13 in Fountain Hills, AZ, was the observation that just because new advanced packaging types are being introduced to the market, it doesn’t mean that older ones...
Is Si photonics the vehicle that will finally catapult 2.5D and 3D IC to stardom? While that was the story told during an R&D panel at SEMICON West, it’s not exactly accurate. At this week’s 3D Architectures for Semiconductor Integration and Packaging (3D ASIP) which took place Wednesday, December 11, 2013...
Start-up Triton Microtechnologies, a designer and manufacturer of ultra-thin glass interposer technology that enables advanced semiconductor-packaging solutions, has met six-month production milestones that have triggered an additional $3.2M in funding from parent companies Asahi Glass Co., Ltd. (AGC) of Tokyo and nMode Solutions Inc. in Oro Valley, Arizona. Triton will...
