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HVM OSAT In Peoria, AZ Commerce Secretary Gina M. Raimondo has identified advanced packaging as a major area of focus for the US government’s effort to rebuild American semiconductor manufacturing. The Commerce Department emphasized that developing robust advanced packaging manufacturing capacity and capability is a key priority and essential to...
The 21st Annual IMAPS Device Packaging Conference (DPC 2025) will be held in Phoenix, Arizona, on March 3-6, 2025. As preparations begin for the event, IMAPS is currently accepting abstracts for technical presentations and Professional Development Courses through September 1, 2024. The 2025 IMAPS Device Packaging Conference will feature four...
At this year’s IEEE International Electron Device Meeting, [IEDM] (December in San Francisco) SK hynix gave an interesting look at “Advanced Packaging Technology in Memory Applications for Future Generative AI Era”. [Generative AI creates new content through the use of machine learning models such as generative adversarial networks. Such frameworks...
Taipei, Taiwan – At this week’s SEMICON Taiwan, Henkel brings its extensive range of semiconductor packaging material solutions to customers in a collaborative setting designed to foster discussions that will help address application challenges. With recently launched innovations for high-reliability advanced packaging and wirebond devices, the company will showcase its...
Cadence, ASE Group, and Chung Yuan Christian University (CYCU) announced collaboration on an education and training program to cultivate talent for 3D-IC Design. Cadence collaborates with universities on system packaging education and talent development through the Cadence Academic Network program, which provides students with access to Cadence advanced IC packaging...
• Process innovation for through-glass vias in the field of advanced packaging • Premiere at Touch Taiwan on April 19-21 in Taipei Plan Optik AG (Elsoff, Germany) and 4JET microtech (Alsdorf, Germany) have jointly developed a process chain for the highly productive production of metallized through-glass vias. The new VLIS...
I wanted this blog to cover the recent whitepaper by Siemens’ EDA division on chiplet model standardization, and it will, but first I need to go over some introductory material on chiplets, and specifically, chiplet definition. Let me explain why. As part of the work that I do with the...
Finishing up our coverage of the 2021 IEEE 3DIC conference, we take a closer look at glass embedding, 3D stacked packaging for retinal prosthesis, and the chiplet design exchange. Georgia Tech – Glass Embedding Madhavan Swaminathan, who has replaced Rao Tummala as the Director of the GaTech Packaging Research Center...
Is Si photonics the vehicle that will finally catapult 2.5D and 3D IC to stardom? While that was the story told during an R&D panel at SEMICON West, it’s not exactly accurate. At this week’s 3D Architectures for Semiconductor Integration and Packaging (3D ASIP) which took place Wednesday, December 11, 2013...
Start-up Triton Microtechnologies, a designer and manufacturer of ultra-thin glass interposer technology that enables advanced semiconductor-packaging solutions, has met six-month production milestones that have triggered an additional $3.2M in funding from parent companies Asahi Glass Co., Ltd. (AGC) of Tokyo and nMode Solutions Inc. in Oro Valley, Arizona. Triton will...
