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Yield Engineering Systems (YES) is a leading manufacturer of process equipment for AI and HPC semiconductor solutions. YES announced that it has received multiple orders of its VertaCure PLP systems for advanced packaging from a leading semiconductor manufacturer in Japan. These systems will be utilized in the manufacturing of AI...
Yield Engineering Systems (YES) is a leading manufacturer of process equipment for AI and HPC semiconductor solutions. YES announced today that it is releasing VertaCure XP G3 curing systems for production. These systems will be utilized in the manufacturing of advanced packaging of AI and HPC solutions, where they will...
This month has been full of exciting advancements and milestones for our members. From cutting-edge technological breakthroughs and prestigious award recognitions to innovative partnerships, impactful collaborations, and significant company developments, our members continue to make remarkable strides in their fields. Here’s a closer look at the highlights and achievements they’ve...
Fraunhofer IZM, a world-leading research institute for advanced microelectronic packaging, and Rapidus Corporation, Japan‘s high-end microelectronics manufacturer founded in 2022, join forces for advanced packaging solutions for 2nm node high-performance computing modules. Rapidus is building a fab on the island of Hokkaido to manufacture 2nm node microchips and the related...
FRT MicroProf® PT Automates Measurement to Reduce Processing Costs on Panels up to 600mm x 600mm LIVERMORE, CA – (Globe Newswire – May 31, 2023) – FormFactor, Inc. (NASDAQ:FORM), a leading semiconductor test and measurement supplier, today introduced the FRT MicroProf® PT, a new semiconductor metrology and inspection tool for...
Santee, Calif. – 14 April 2023 – StratEdge Corporation, leader in the design, production, and assembly of high-frequency and high-power semiconductor packages for RF, microwave, and millimeter-wave devices, is set to showcase its latest packaging technology for high-temperature applications at several industry conferences in April and May. The events will take place...
ANDOVER, Mass., Aug. 09, 2022 (GLOBE NEWSWIRE) — Mercury Systems Inc. (NASDAQ: MRCY, www.mrcy.com), a leader in trusted, secure mission-critical technologies for aerospace and defense, announced it received a $12 million order from a leading defense prime contractor to provide advanced trusted and secure manufacturing and packaging for their GPS...
Watching the Intel Accelerated event recently brings to mind one of my favorite movies of all time: Rocky. Let me share the fact that Sylvester Stallone (3 years older than I am) and I actually grew up in the same NYC neighborhood, Hell’s Kitchen (he later moved to Philly). At...
Projections for PC growth are flat and shipments of smartphones show low growth rates. Demand for cryptocurrency devices in flip-chip CSPs and BGAs is expected to provide increased volumes this year to help keep foundries and OSATs busy. Few are willing to add foundry, substrate, or assembly capacity for cryptocurrency...
Sure, 3D integration and packaging isn’t the only game in the semiconductor industry town, but even at events like last week's 2009 International Wafer-Level Packaging Conference (IWLPC), which covers the gamut of packaging technologies, 3D topics are the main attraction. Speakers and panelists pointed to 3D solutions at the wafer,...
