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Fraunhofer IZM, a world-leading research institute for advanced microelectronic packaging, and Rapidus Corporation, Japan‘s high-end microelectronics manufacturer founded in 2022, join forces for advanced packaging solutions for 2nm node high-performance computing modules. Rapidus is building a fab on the island of Hokkaido to manufacture 2nm node microchips and the related...
Challenges to 3DHI and chiplets remain, but new advanced packaging foundry solutions are stacking up The industry consensus is that the path to extending Moore’s Law lies in heterogeneous integration (HI) and chiplet architectures. Why, then, are we still waiting for the full adoption of HI, 3DHI, and chiplets? The...
FRT MicroProf® PT Automates Measurement to Reduce Processing Costs on Panels up to 600mm x 600mm LIVERMORE, CA – (Globe Newswire – May 31, 2023) – FormFactor, Inc. (NASDAQ:FORM), a leading semiconductor test and measurement supplier, today introduced the FRT MicroProf® PT, a new semiconductor metrology and inspection tool for...
Santee, Calif. – 14 April 2023 – StratEdge Corporation, leader in the design, production, and assembly of high-frequency and high-power semiconductor packages for RF, microwave, and millimeter-wave devices, is set to showcase its latest packaging technology for high-temperature applications at several industry conferences in April and May. The events will take place...
Interconnect reliability is critical to the reliability of semiconductor packaging and electronic systems. If we look at the life cycle from the chip to the system—from IC design, wafer fab, and packaging, to board assembly and system integration—the common element is the “interconnect thread” for the reliability of the electronic...
ANDOVER, Mass., Aug. 09, 2022 (GLOBE NEWSWIRE) — Mercury Systems Inc. (NASDAQ: MRCY, www.mrcy.com), a leader in trusted, secure mission-critical technologies for aerospace and defense, announced it received a $12 million order from a leading defense prime contractor to provide advanced trusted and secure manufacturing and packaging for their GPS...
Watching the Intel Accelerated event recently brings to mind one of my favorite movies of all time: Rocky. Let me share the fact that Sylvester Stallone (3 years older than I am) and I actually grew up in the same NYC neighborhood, Hell’s Kitchen (he later moved to Philly). At...
Projections for PC growth are flat and shipments of smartphones show low growth rates. Demand for cryptocurrency devices in flip-chip CSPs and BGAs is expected to provide increased volumes this year to help keep foundries and OSATs busy. Few are willing to add foundry, substrate, or assembly capacity for cryptocurrency...
NEWBURY PARK, CALIF.--Tamar Technology received an order for its WaferScan metrology system from a major semiconductor manufacturer. The system will be used for 3DIC packaging and process development. Tamar’s WaferScan system provides high-speed non-destructive metrology for 3DIC advanced packaging processes being developed for high volume manufacturing (HVM). The system has...
Sure, 3D integration and packaging isn’t the only game in the semiconductor industry town, but even at events like last week's 2009 International Wafer-Level Packaging Conference (IWLPC), which covers the gamut of packaging technologies, 3D topics are the main attraction. Speakers and panelists pointed to 3D solutions at the wafer,...
