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At this year’s IEEE International Electron Device Meeting, [IEDM] (December in San Francisco) SK hynix gave an interesting look at “Advanced Packaging Technology in Memory Applications for Future Generative AI Era”. [Generative AI creates new content through the use of machine learning models such as generative adversarial networks. Such frameworks...
Challenges to 3DHI and chiplets remain, but new advanced packaging foundry solutions are stacking up The industry consensus is that the path to extending Moore’s Law lies in heterogeneous integration (HI) and chiplet architectures. Why, then, are we still waiting for the full adoption of HI, 3DHI, and chiplets? The...
Taipei, Taiwan – At this week’s SEMICON Taiwan, Henkel brings its extensive range of semiconductor packaging material solutions to customers in a collaborative setting designed to foster discussions that will help address application challenges. With recently launched innovations for high-reliability advanced packaging and wirebond devices, the company will showcase its...
Austin, August 29, 2023 – PulseForge Inc., a recognized leader in applied thermal energy, and Applied Novel Devices (AND), a pioneering force in new semiconductor device architectures for discrete and integrated power products, have joined forces to demonstrate a groundbreaking advancement in the field of power electronics packaging through photonic...
• Process innovation for through-glass vias in the field of advanced packaging • Premiere at Touch Taiwan on April 19-21 in Taipei Plan Optik AG (Elsoff, Germany) and 4JET microtech (Alsdorf, Germany) have jointly developed a process chain for the highly productive production of metallized through-glass vias. The new VLIS...
Interconnect reliability is critical to the reliability of semiconductor packaging and electronic systems. If we look at the life cycle from the chip to the system—from IC design, wafer fab, and packaging, to board assembly and system integration—the common element is the “interconnect thread” for the reliability of the electronic...
Finishing up our coverage of the 2021 IEEE 3DIC conference, we take a closer look at glass embedding, 3D stacked packaging for retinal prosthesis, and the chiplet design exchange. Georgia Tech – Glass Embedding Madhavan Swaminathan, who has replaced Rao Tummala as the Director of the GaTech Packaging Research Center...
An interesting take-away from the keynote talk delivered by Brandon Prior, Prismark Partners, at this year’s IMAPS International Device Packaging Conference, held March 11-13 in Fountain Hills, AZ, was the observation that just because new advanced packaging types are being introduced to the market, it doesn’t mean that older ones...
Is Si photonics the vehicle that will finally catapult 2.5D and 3D IC to stardom? While that was the story told during an R&D panel at SEMICON West, it’s not exactly accurate. At this week’s 3D Architectures for Semiconductor Integration and Packaging (3D ASIP) which took place Wednesday, December 11, 2013...
Start-up Triton Microtechnologies, a designer and manufacturer of ultra-thin glass interposer technology that enables advanced semiconductor-packaging solutions, has met six-month production milestones that have triggered an additional $3.2M in funding from parent companies Asahi Glass Co., Ltd. (AGC) of Tokyo and nMode Solutions Inc. in Oro Valley, Arizona. Triton will...
