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Semiconductor industry experts will convene at SEMICON Europa 2024, November 12-15 at Messe München in Munich, to explore the latest trends and innovations in advanced packaging and fab management. The Advanced Packaging Conference (APC) and Fab Management Forum (FMF) at SEMICON Europa will each focus on driving sustainable solutions to meet the evolving demands of...
We’ve been following several stories on U.S. base expansion stories made possible by U.S. Chips Funding Awards. Here is an update on three of them. NHanced Terminates Bloomington IND Expansion Plans We recently discussed NHanced Semiconductors‘ plans for expansion in Morrisville NC, Bloomington IND and Odon IND. This past week...
In 1987, the lithography team I worked with returned from SPIE and presented our findings from the conference. Ultra-violet (UV) lithography was just crossing the 1µm line widths, and the industry was looking for what might be next to replace it. At that time, e-beam lithography was still in contention...
Austin, August 29, 2023 – PulseForge Inc., a recognized leader in applied thermal energy, and Applied Novel Devices (AND), a pioneering force in new semiconductor device architectures for discrete and integrated power products, have joined forces to demonstrate a groundbreaking advancement in the field of power electronics packaging through photonic...
The top global event for Chiplet and Heterogeneous Integration Packaging (CHIP), covering advanced technology developments and solutions, device integration strategies, and business trends. IMAPS has rebranded its well-attended, annual Advanced System-in-Package conference to the Chiplet & Heterogeneous Integration Packaging Conference CHIPcon. As the world’s leading semiconductor companies continue to push...
This past fall, our packaging industry saw significant shortages of packaging substrates made from Ajinomoto Build-up Film (ABF). Let’s take a closer look. Ajinomoto is not your typical electronics materials company. Its main product lines are food seasonings, amino acids, and pharma products. The company entered the electronic materials industry...
Samsung Electronics has announced the development of 12-layer memory using 3D through silicon via (3D-TSV) chip packaging technology. TSVs vertically interconnect the two DRAM chips through more than 60,000 TSVs. Despite the increase in the number of layers from eight to 12, the overall thickness of the package remains at...
Wilmington, Mass. (July 11, 2016)—Rudolph Technologies, Inc. (NYSE: RTEC) today unveiled its new patented Clearfind™ technology, which can detect organic defects that are difficult or impossible to see with conventional white-light imaging techniques. Organic contaminants are often the root cause of field failures, which occur after the material has been exposed...
Rambus Inc, one of the world's premier technology licensing companies, announced today it is engaging with the Industrial Technology Research Institute (ITRI) in Taiwan, one of the world's leading research institutes, on the development of interconnect and 3D packaging technologies. In addition, Rambus has joined the Advanced Stacked-System Technology and...
Alchimer, provider of nanometric film deposition for advanced 3D packaging applications as well as semiconductor interconnects, MEMS and other electronic technologies, announced a new wet-deposition process, AquiVantage, that grows interconnect layers for interposer redistribution layers (RDLs) and significantly enhances via-last backside wafer interconnects. AquiVantage uses the same cost-saving
