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Fraunhofer IZM, a world-leading research institute for advanced microelectronic packaging, and Rapidus Corporation, Japan‘s high-end microelectronics manufacturer founded in 2022, join forces for advanced packaging solutions for 2nm node high-performance computing modules. Rapidus is building a fab on the island of Hokkaido to manufacture 2nm node microchips and the related...
Santee, Calif. – 14 April 2023 – StratEdge Corporation, leader in the design, production, and assembly of high-frequency and high-power semiconductor packages for RF, microwave, and millimeter-wave devices, is set to showcase its latest packaging technology for high-temperature applications at several industry conferences in April and May. The events will take place...
The top global event for Chiplet and Heterogeneous Integration Packaging (CHIP), covering advanced technology developments and solutions, device integration strategies, and business trends. IMAPS has rebranded its well-attended, annual Advanced System-in-Package conference to the Chiplet & Heterogeneous Integration Packaging Conference CHIPcon. As the world’s leading semiconductor companies continue to push...
As a small U.S. semiconductor packaging company, Mosaic Microsystems is very supportive of the CHIPS Act and looks forward to contributing to the efforts being taken to strengthen the U.S. semiconductor industry. Our business focuses on the use of glass for substrates and interposers, which are critical technologies required by...
I wanted this blog to cover the recent whitepaper by Siemens’ EDA division on chiplet model standardization, and it will, but first I need to go over some introductory material on chiplets, and specifically, chiplet definition. Let me explain why. As part of the work that I do with the...
ANDOVER, Mass., Aug. 09, 2022 (GLOBE NEWSWIRE) — Mercury Systems Inc. (NASDAQ: MRCY, www.mrcy.com), a leader in trusted, secure mission-critical technologies for aerospace and defense, announced it received a $12 million order from a leading defense prime contractor to provide advanced trusted and secure manufacturing and packaging for their GPS...
Watching the Intel Accelerated event recently brings to mind one of my favorite movies of all time: Rocky. Let me share the fact that Sylvester Stallone (3 years older than I am) and I actually grew up in the same NYC neighborhood, Hell’s Kitchen (he later moved to Philly). At...
Projections for PC growth are flat and shipments of smartphones show low growth rates. Demand for cryptocurrency devices in flip-chip CSPs and BGAs is expected to provide increased volumes this year to help keep foundries and OSATs busy. Few are willing to add foundry, substrate, or assembly capacity for cryptocurrency...
The Great Miniaturization … SEMI/MEPTEC Conference Nov 10 & 11, continued from Part 1. Wednesday morning started with a IC packaging session focused on my favorite subject: Multi-die Integration. Trevor Yancey, who recently joined Jan Vardaman at TechSearch International, talked about the IoT and gave an example for how the...
Sure, 3D integration and packaging isn’t the only game in the semiconductor industry town, but even at events like last week's 2009 International Wafer-Level Packaging Conference (IWLPC), which covers the gamut of packaging technologies, 3D topics are the main attraction. Speakers and panelists pointed to 3D solutions at the wafer,...
