Matches for your search: "fan-out wafer level packaging "
We’ve been following several stories on U.S. base expansion stories made possible by U.S. Chips Funding Awards. Here is an update on three of them. NHanced Terminates Bloomington IND Expansion Plans We recently discussed NHanced Semiconductors‘ plans for expansion in Morrisville NC, Bloomington IND and Odon IND. This past week...
In 1987, the lithography team I worked with returned from SPIE and presented our findings from the conference. Ultra-violet (UV) lithography was just crossing the 1µm line widths, and the industry was looking for what might be next to replace it. At that time, e-beam lithography was still in contention...
Advanced Packaging’s Growth in AI TechSearch International’s latest analysis examines the demand for packages used in AI. As the industry enters the AI era, successful hardware deployment requires a supply of silicon interposers, or alternatives such as redistribution layer (RDL) structures and advanced laminates, to support high density. With the...
ANDOVER, Mass., April 19, 2022 (GLOBE NEWSWIRE) — Mercury Systems, Inc. (NASDAQ: MRCY, www.mrcy.com), a leader in trusted, secure mission-critical technologies for aerospace and defense, announced it has been selected to provide trusted and secure advanced packaging for the Office of the Undersecretary of Defense for Research and Engineering’s (OUSD...
This past fall, our packaging industry saw significant shortages of packaging substrates made from Ajinomoto Build-up Film (ABF). Let’s take a closer look. Ajinomoto is not your typical electronics materials company. Its main product lines are food seasonings, amino acids, and pharma products. The company entered the electronic materials industry...
Just like most other events that attract a large number of people, TSMC 2020 events were held online too. While I missed the many friends I normally meet at TSMC events, I was able to follow the powerful messages from TSMC, its Open Innovation Platform (OIP) partners, and satisfied customers...
Samsung Electronics has announced the development of 12-layer memory using 3D through silicon via (3D-TSV) chip packaging technology. TSVs vertically interconnect the two DRAM chips through more than 60,000 TSVs. Despite the increase in the number of layers from eight to 12, the overall thickness of the package remains at...
NEWBURY PARK, CALIF.--Tamar Technology received an order for its WaferScan metrology system from a major semiconductor manufacturer. The system will be used for 3DIC packaging and process development. Tamar’s WaferScan system provides high-speed non-destructive metrology for 3DIC advanced packaging processes being developed for high volume manufacturing (HVM). The system has...
Rambus Inc, one of the world's premier technology licensing companies, announced today it is engaging with the Industrial Technology Research Institute (ITRI) in Taiwan, one of the world's leading research institutes, on the development of interconnect and 3D packaging technologies. In addition, Rambus has joined the Advanced Stacked-System Technology and...
Alchimer, provider of nanometric film deposition for advanced 3D packaging applications as well as semiconductor interconnects, MEMS and other electronic technologies, announced a new wet-deposition process, AquiVantage, that grows interconnect layers for interposer redistribution layers (RDLs) and significantly enhances via-last backside wafer interconnects. AquiVantage uses the same cost-saving
