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By Jim Straus and Sally-Ann Henry, ACM Research While heterogeneous integration of multiple components and 2.5D/3D packaging techniques pair perfectly with complex stacking architectures, these technologies elicit high demands on device manufacturing processes. Through-silicon vias (TSVs) are a key enabler, allowing direct chip-to-chip connection through the chip stack without requiring...
November 9, 2023 Kalispell, MT —ClassOne Technology, a leading global provider of advanced electroplating and wet processing tools for microelectronics manufacturing, today announced that leading European research institution VTT Technical Research Centre of Finland has placed its first order for a ClassOne Solstice® S8 single-wafer system. VTT will leverage the tool’s...
Continuing our look at the IMAPS Onshoring conference with a look at U.S. OSAT activities. (We should note that while this conference was listed for US & Canadian Citizens only, we are showing materials that were explicitly listed as “Unclassified; approved for public release; distribution unlimited” only.) IBM Bromont Rox...
Order for multi-chamber Solstice® GoldPro™ electroplating system selected for superior process and performance in high-volume manufacturing of microLED devices KALISPELL, Mont. – February 1, 2023 – ClassOne Technology, a leading global provider of advanced electroplating and wet processing tools for microelectronics manufacturing, today announced it has received a follow-on order...
As predicted, 2020 will go down as the year 5G hit the big time. But it got off to a rocky start. Back in January, the semiconductor industry—and the world as a whole—had high hopes for the 5G rollout. Then COVID-19 hit, and two things happened. First, progress on the...
On the whole, 2019 was a very interesting year for the global semiconductor industry. After a record-setting 2018, the market saw a decline caused by a softening memory market, coupled with an uncertain geopolitical climate. The U.S.-China trade war, in particular, has impacted semiconductor equipment suppliers based in the United...
Lam Research Corp. (Nasdaq: LRCX) is offering new capabilities in its semiconductor manufacturing systems portfolio to further improve device yield at the edge of the wafer, which is essential to delivering greater productivity for customers. During the semiconductor production process, device manufacturers want to build integrated circuits on the entire...
It’s common knowledge among those working feverishly to bring 3D TSVs to market that one of the areas still being ironed out in the back-end-of-line processes is thin wafer handling.
With the recent announcement of CEA-Léti and Brewer Science's agreement to create a common lab for further development of 3D stacking processes using Léti’s thin wafer handling processes and Brewer Science, Inc. (BSI) WaferBOND™ materials, I realized although both names popped up frequently in relation to the
When will I learn that skirts and clean room tours don’t mix? And I always seem to be visiting EVG’s facilities when these situations arise. Yesterday at their Open House in Tempe, it wasn’t a clean room suit incident. It was the waffle floors with upward ventilation that almost caught...
