Matches for your search: "fan-out wafer level packaging "
November 9, 2023 Kalispell, MT —ClassOne Technology, a leading global provider of advanced electroplating and wet processing tools for microelectronics manufacturing, today announced that leading European research institution VTT Technical Research Centre of Finland has placed its first order for a ClassOne Solstice® S8 single-wafer system. VTT will leverage the tool’s...
Continuing our look at the hybrid bonding (HB) presentations at the recent IMAPS Device Packaging Conference with a look at Adeia’s presentation. Adeia (previously known as Xperi/Tessera/Ziptronix – Tessera acquired Ziptronix in 2010) has been focusing on bringing die-to-wafer (D2W) HB to the memory market. The presentation discussed “Hybrid Bonding...
Building a state-of-the-art integrated circuit takes a lot of resources. Water, energy, chemicals, gases, and silicon wafers are just a few of the key elements required to build a chip. According to Scotten W. Jones at IC Knowledge LLC, there are 600 to 800 process steps at 5nm depending on...
Chalk up another industry first for Tezzaron Semiconductor, who announced just today (or tomorrow, if you are there for the excitement at IEEE 3DIC in Sendai, Japan) that along with their manufacturing subsidiary, Novati Technologies, they have successfully manufactured the world’s first eight-layer 3D IC wafer stack containing active logic. (Figure 1). According...
Indium Corporation’s wafer bumping flux WS-3543 is a low-viscosity semiconductor-grade flux, specifically optimized for uniform solder bump formation across wafers up to 300mm (12 inches) in diameter. WS-3543 washes off completely, even after repeated application, reflow, and cleaning cycles, as may be seen in bump rework and after probe testing....
Rudolph Technologies, Inc. announced that it has won orders for its AWX™ FSI unpatterned wafer inspection system at both a major Southeast Asia-based outsourced assembly and test (OSAT) facility and a key Korean memory manufacturer. In both cases, the systems were selected after direct comparison with entrenched competitors. The AWX...
A few weeks ago I spoke with SPTS’s David Butler, after he participated in the SEMICON Singapore 3D IC panel. We talked a lot about the importance of wafer planarity for performing backside processes like TSV reveal. Butler commented that regardless of a tool’s calibrated precision, its only as good...
This year’s 3D InCites coverage of ECTC 2013 features a series of interviews with suppliers to the 2.5D and 3D IC market. I spoke with a number of exhibiting and attending companies who had progress reports on their tools, processes and materials aimed at leaping over the remaining hurdles. The...
We read a lot about the remaining challenges to be addressed before 3D ICs are fully commercialized. Current roadmaps are now targeting 2015 for commercialization of 3D ICs, while 2.5D gets the ball rolling towards the end of 2012, beginning of 2013. Reports from Xilinx indicate they are shipping 2.5D...
After seeing the latest press release on Ziptronix foray into the memory space, I sought out Kathy Cook, business development manager at Ziptronix, at ECTC to get the full story. We’ve been reading and hearing a lot about Ziptronix ZiBond process being used in CMOS image sensor (BSI) technology, and particularly...
