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Global Leader in microLED Manufacturing Orders Repeat Solstice® S8 Single-Wafer Electroplating System from ClassOne Technology

Feb 01, 2023

Order for multi-chamber Solstice® GoldPro™ electroplating system selected for superior process and performance in high-volume manufacturing of microLED devices KALISPELL, Mont. – February 1, 2023 – ClassOne Technology, a leading global provider of advanced electroplating and wet processing tools for microelectronics manufacturing, today announced it has received a follow-on order...

2020 Global Silicon Revenue Remains Stable as Wafer Area Shipments Edge Up Despite COVID-19 Disruption

Feb 02, 2021

MILPITAS, Calif. — Feb. 2, 2021 — Worldwide silicon wafer area shipments in 2020 increased while revenue remained unchanged from 2019 at $11,170 million, the SEMI Silicon Manufacturers Group (SMG) reported in its year-end analysis of the silicon wafer industry. Silicon shipments totaled 12,407 million square inches (MSI), compared to...

The 5G Rollout: An Industry in Transition

Jan 12, 2021

As predicted, 2020 will go down as the year 5G hit the big time. But it got off to a rocky start. Back in January, the semiconductor industry—and the world as a whole—had high hopes for the 5G rollout. Then COVID-19 hit, and two things happened. First, progress on the...

Successful Growth in 2020 Calls for a Sustainable Approach

Jan 15, 2020

On the whole, 2019 was a very interesting year for the global semiconductor industry. After a record-setting 2018, the market saw a decline caused by a softening memory market, coupled with an uncertain geopolitical climate. The U.S.-China trade war, in particular, has impacted semiconductor equipment suppliers based in the United...

Lam Research Offers New Capabilities in its Edge Yield Product Portfolio

Dec 03, 2019

Lam Research Corp. (Nasdaq: LRCX) is offering new capabilities in its semiconductor manufacturing systems portfolio to further improve device yield at the edge of the wafer, which is essential to delivering greater productivity for customers. During the semiconductor production process, device manufacturers want to build integrated circuits on the entire...

New Defect Inspection Systems Address Process and Tool Monitoring Challenges

Jul 18, 2018

MILPITAS, Calif., July 10, 2018—Today KLA-Tencor Corporation (NASDAQ: KLAC) announced two new defect inspection products, addressing two key challenges in tool and process monitoring during silicon wafer and chip manufacturing at the leading-edge logic and memory nodes. The VoyagerTM 1015 system offers a new capability to inspect patterned wafers, including...

Check this out: easier debonding?

Dec 12, 2012

It’s common knowledge among those working feverishly to bring 3D TSVs to market that one of the areas still being ironed out in the back-end-of-line processes is thin wafer handling.

Léti and Brewer Science: sharing a common lab and a common goal

Dec 12, 2012

With the recent announcement of CEA-Léti and Brewer Science's agreement to create a common lab for further development of 3D stacking processes using Léti’s thin wafer handling processes and Brewer Science, Inc. (BSI) WaferBOND™ materials, I realized although both names popped up frequently in relation to the

3D companies address critical areas

Dec 12, 2012

It’s only Tuesday, and already, it’s been a productive week for 3D news.

Growing Up with MEMS

Mar 11, 2010

When will I learn that skirts and clean room tours don’t mix? And I always seem to be visiting EVG’s facilities when these situations arise. Yesterday at their Open House in Tempe, it wasn’t a clean room suit incident. It was the waffle floors with upward ventilation that almost caught...