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MUNICH, February 6th, 2024 – ERS electronic, the industry leader in the market of thermal management solutions for semiconductor manufacturing, is pleased to announce that Debbie-Claire Sanchez has been appointed Vice President with immediate effect. Debbie joined ERS in 2019 as Strategic Product Manager for the company’s Fan-out Business Unit,...
Despite travel restrictions due to the Coronavirus, Dr. Douglas Yu, Vice President of R&D for TSMC gave a keynote via WebEx at the IMAPS Device Packaging Conference on March 3, 2020. He described the new era that the industry has entered, and specifically how heterogeneous integration technologies are ushering in...
“We believe that materials science changes the world,” declared Indium Corporation’s Andy Mackie during our recent sit-down together at IMAPS 2019 in Boston, MA. Even though I am a chemical engineer myself, and not a materials scientist, Andy Mackie, Ph.D., senior product manager, is reaching the choir, one engineer to...
Growth for high-density fan-out wafer level packages (FO-WLPs) continues unabated, with Apple’s continued use of TSMC’s InFO process in its smartphone application processors. Standard FO-WLP has experienced a few bumps on the road to higher volumes this year. Problems with Qualcomm’s steep ramp of FO-WLP for its PMICs and RF...
Part one of a five-part series. Over the past few years, there has been a significant shift from PCs and notebooks to smartphones and tablets as drivers of advanced packaging innovation. In an industry segment that has grown accustomed to a multitude of package varieties, we believe we are now...
CIRCL-AP™ is a cluster tool with multiple modules, covering all-surface inspection, metrology and review at high throughput for efficient advanced wafer level packaging (AWLP) process control. The CIRCL-AP provides production-proven, high sensitivity monitoring capability for multiple AWLP applications including 2.5D/3D integration, wafer-level chip scale packaging and fan-out wafer-level packaging. Testimonial...
If, as we heard at last week’s 3D IC Forum at SEMICON Singapore, that technology challenges and cost are no longer keeping 3D ICs from volume manufacturing, and indeed the key players are ready to go, then what’s it going to take to get this 3D IC adoption party started?...
2.5D interposers sparked a good amount of discussion at this year’s 3D ASIP conference (December 11-13, 2013, Burlingame CA), with a session devoted to “Interposers for all of Us” and other presentations scattered throughout the program to address such issues as thin wafer handling, and heterogeneous integration. Weighing in on...
NANIUM S.A. has introduced an improved dielectric material and process solution for its fan-out wafer-level packaging (FOWLP) technology, embedded wafer-level ball grid array (eWLB). These improvements increase eWLB’s reliability, thereby extending the existing technology platform into more demanding markets and applications including medical devices, aerospace and automotive, among others. The...
There’s been lots of news lately about the transition to 450mm wafers, and I’m wondering, is it only me, or are there others who are amazed at how little mention there is on its impact in the assembly and packaging world. It’s like the front-end has forgotten that the back-end...
