QP Technologies New TQFP and MQFP Offerings Increase Packaging Options for Mil-Aero, Automotive and Other Key Markets
ESCONDIDO, Calif. – March 16, 2023 – QP Technologies™, a leading provider of innovative microelectronic packaging and assembly solutions, today announced it has extended its broad plastic package assembly portfolio with two new offerings: a 64-pin thin quad flat pack (TQFP) and a 52-pin metric quad flat pack (MQFP) plastic encapsulated package. These options are...