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Riding the 3D/Heterogeneous Integration Wave For decades, the ability to achieve the necessary power, performance, area, and cost (PPAC) in semiconductor manufacturing had been largely driven by 2D design rule shrinks enabled through advances in lithography. In recent years, however, the rising costs and complexity associated with 2D shrinks have...
Chiplets have become a strategic asset for designers who are implementing them in all sorts of applications. Until now, chiplet verification until now has been overlooked. I discussed this phenomenon with Dave Kelf, CEO of Breker Verification Systems, an ESD Alliance member company and provider of verification solutions that leverage...
Actually, 3D System integration takes more than a village. It takes a global effort. As Virtual ECTC 2020 continues this month, I viewed the 3D Past, Present, and Future of 3D integration Plenary Session. The actual viewing time is just over 115 minutes. The impressive speaker line-up included 3D pioneers,...
Despite travel restrictions due to the Coronavirus, Dr. Douglas Yu, Vice President of R&D for TSMC gave a keynote via WebEx at the IMAPS Device Packaging Conference on March 3, 2020. He described the new era that the industry has entered, and specifically how heterogeneous integration technologies are ushering in...
There is fierce competition for scaling foundry logic technologies. However, according to the 2015 International Roadmap for Semiconductors (ITRS), logic transistor scaling will stop at 10nm and it will no longer be economically desirable for companies to continue traditional transistor miniaturization in microprocessors1. How will this impact the lifespan of CMOS...
SAN JOSE, Calif. — Ziptronix, Inc., a wholly owned subsidiary of Tessera Technologies, Inc. (NASDAQ:TSRA) (“Tessera” or the “Company”) and the leader in low temperature wafer bonding technology, today announced it has entered into a development agreement with Fraunhofer IZM-ASSID (“Fraunhofer”). The companies will work together to integrate Ziptronix Direct...
For the first time this year, 3D InCites is sponsoring a panel discussion at IWLPC on the topic of System-level Advantages of 3D Integration. For years the industry has discussed and debated 3D integration technologies, discussing the market drivers, technology challenges, supply chain issues, and above all, the cost. As...
With the continued innovations in packaging technologies and 2.5D interposers pushing 3D ICs further out from one end, and 16/14nm nodes already qualified without TSVs, making us wait until 10nm, are 3D ICs suddenly getting the squeeze from both sides? That’s one theory I took away from all the conversations...
2.5D interposers sparked a good amount of discussion at this year’s 3D ASIP conference (December 11-13, 2013, Burlingame CA), with a session devoted to “Interposers for all of Us” and other presentations scattered throughout the program to address such issues as thin wafer handling, and heterogeneous integration. Weighing in on...
As this year’s 3D IC Test Workshop unfolded (September 12 & 13, 2012), one thing became increasingly clear to me: the challenge of probing microbumps is an item of critical concern in 3D test. During the panel discussion on test requirements for 3D ICs, Saman Adham of TSMC Canada, noted...
