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TechSearch International’s latest report: 2022 Flip Chip and WLP: Trends and Market Forecasts examines the impact of slowing consumer demand on the flip chip and WLP market growth. The report includes an examination of both fan-in WLP and fan-out WLP markets. The report also examines bump pitch trends and the...
The International Microelectronics Assembly and Packaging Society (IMAPS) will host a one-day Workshop to discuss and promote strategies to improve on-shore packaging and assembly capabilities on October 3, 2022, at the Hynes Convention Center, Boston, Massachusetts. This workshop will be followed by the IMAPS 2022 Symposium, October 3-6 at the...
Chiplets are the new “It” heterogeneous integration technology. In fact, the big news in Taiwan this week is that Apple is entertaining the idea of using TSMC’s 3D interconnect fabric – which is based on the company’s approach to chiplet integration. According to Taiwan News, other companies considering the technology...
Let’s take a final look at some of the presentations from the 2021 IMAPS Device Packaging workshop. Applied Materials Applied Materials (AMAT) discussed “Through Silicon Vias (TSVs) and Hybrid Bonding Solutions for Heterogeneous Integration…”. AMAT notes that hybrid bonding is not a new technology but rather has been commercialized for...
Siemens Digital Industries Software today announced that its collaboration with Advanced Semiconductor Engineering, Inc. (ASE) has generated two new enablement solutions engineered to help mutual customers create and evaluate multiple complex integrated circuit (IC) package assemblies and interconnect scenarios in an easy-to-use, data-robust graphical environment prior to and during physical...
This year’s SEMI 3D & Systems Summit was held in late January in Dresden. In the next few blogs, we will take a look at some of the interesting material that was presented. Savansys Activity-based Cost Modeling Amy Lujan from Savansys discussed their activity-based cost modeling of a chip on...
Over the years on 3D inCites, we’ve discussed the debate about the advantages and disadvantages of using glass substrates for advanced packaging applications. Thanks to ongoing research and development, a clear path has emerged for the use of glass in two key areas: as carrier substrates for high-density fan-out (FO)...
As packaging practitioners/experts themselves, regular readers know that IFTLE is always on the lookout for the latest applications and the latest chips going into those applications because all those chips will have to be packaged. However, IFTLE has previously warned the reader to beware of technology hype, which appears to...
The cynic inside often thinks “All hat, no cattle” about the newest new, new thing (right, Michael Lewis?). But if you were to consult the Gartner Hype Cycle listings from 2008 as I just did you would find, perhaps to your surprise, that Cloud Computing, 3-D Printing, Solid-State Drives, and...
Whenever Francoise organizes an event, she always manages to compose a mixture of entertainment, real work and valuable education. This panel was no different. Francoise moderated the IWLPC 2015 Panel Discussion: Interposers, 3D TSVs, and Alternatives: What are the Options and Where do They Fit? featuring Aric Shorey, Corning, Inc.; Thibeault Buisson, Yole...
