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CHIPS for America has announced three anticipated CHIPS for America research and development (R&D) flagship facilities. These state-of-the-art CHIP flagship facilities will establish world-class advanced semiconductor R&D in the United States. “They will address critical gaps in the current ecosystem, offering unparalleled value to a diverse array of stakeholders across...
IFTLE has spent significant time discussing the lack of U.S.-based substrate manufacturing. Although packages such as the ball-grid array (BGA) were invented by U.S. companies like Motorola, production capacity was all off-shored to Asia years ago. Having competent U.S. production capacity has always been part of the US reshoring program....
Co-presenting “Photonic Debonding for Wafer–Level Packaging” at CS MANTECH, held May 15-18 in Orlando, FL. Orlando, Florida – April 25, 2023 – Brewer Science, Inc. and PulseForge, Inc. bring substantial cost savings, increased throughput, and other benefits with photonic debonding to semiconductor advanced packaging. This collaboration combines a global leader in manufacturing next-generation materials and...
The Most Comprehensive Program for Microelectronics and Advanced Packaging This Spring The 19th Annual Device Packaging Conference (DPC 2023) will be held March 13-16, 2023, at the WeKoPa Resort and Conference Center in Fountain Hills, Arizona. This esteemed event brings together industry engineers, researchers and top experts involved in advanced packaging and microelectronics assembly with...
ANDOVER, Mass., April 19, 2022 (GLOBE NEWSWIRE) — Mercury Systems, Inc. (NASDAQ: MRCY, www.mrcy.com), a leader in trusted, secure mission-critical technologies for aerospace and defense, announced it has been selected to provide trusted and secure advanced packaging for the Office of the Undersecretary of Defense for Research and Engineering’s (OUSD...
In IFTLE 441, (published in February before we were paying attention to the pandemic and the devastation to the world economy that it has brought) we discussed the desire of the US Government to have on-shore, state-of-the-art (SOTA) microelectronics sources. Recently amid pressure from the US, TSMC announced preliminary plans to...
With nary a farewell glance in the rearview mirror at the terrain successfully covered over the decades during which we followed the ITRS’ Guide Michelin; the new Heterogeneous Integration Roadmap gives us eyes on what comes next. It looks from here-and-now all the way to a horizon that extends, like...
The Internet of Things (IoT) or as Cisco calls it, the Internet of Everything, has been the theme du jour for almost every semiconductor-related industry event in the past year, and going forward for 2015. The IoT hype continues, as many see the opportunity in this global trend to connect people,...
Over the past year… The amount of 2.5/3D articles published has gained momentum. Some articles discuss when HVM will be achieved for this complex packaging, others discuss costs from chip to system levels, how to evaluate options, design and verify, etc. All articles are based on facts gleaned from various articles, presentations...
Invensas Corporation, a wholly owned subsidiary of Tessera Technologies, Inc. , announced today that it has acquired the patent assets of ALLVIA, Inc. In addition, Invensas has entered into a two-year collaborative partnership with ALLVIA to further develop technology and intellectual property (IP) in the 3-dimensional integrated circuit (3D-IC) packaging...
