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IFTLE has spent significant time discussing the lack of U.S.-based substrate manufacturing. Although packages such as the ball-grid array (BGA) were invented by U.S. companies like Motorola, production capacity was all off-shored to Asia years ago. Having competent U.S. production capacity has always been part of the US reshoring program....
ESCONDIDO, Calif. – March 16, 2023 – QP Technologies™, a leading provider of innovative microelectronic packaging and assembly solutions, today announced it has extended its broad plastic package assembly portfolio with two new offerings: a 64-pin thin quad flat pack (TQFP) and a 52-pin metric quad flat pack (MQFP) plastic encapsulated package. These options are...
Santee, Calif. — StratEdge Corporation,leader in the design, production, and assembly of high-frequency and high-power semiconductor packages for RF, microwave, and millimeter-wave devices, will display its molded ceramic packages at the IMAPS Device Packaging, APEC, and GOMACTech conferences, all of which are being held in March. The molded ceramic packages can...
IPC Expo – Defense Electronics Supplier Roundtable The 16th Defense Electronics Supplier Roundtable at the recent IPC APEX EXPO in San Diego (Jan 2023) contained some interesting presentations that serve to add to our recent examination of the many government agencies currently looking to support Advanced Packaging. Craig Herndon, DoD...
Leading-edge semiconductor fabs haven’t been built in the U.S. for a while but that’s about to change. Let’s look at how and where those changes will take place. It is certainly worth reviewing such information because these fabs will be driving the matching advanced packaging that will also be installed...
JISSO JOINT consortium In late 2019 Showa Denko bought Hitachi Chemical (HC) for about $8.9B. HC had an operating income of about $440 million on sales of $6.3B with about 40% of its sales from materials, including chemical mechanical planarization slurries, epoxy compounds, and anode materials for lithium-ion batteries. The...
While we are all conjuring visions of what advanced packaging and in fact transistors themselves will look like in the coming decades, political maneuvering is occurring that just might have an equal impact in reshaping our industry in the future. No need to rehash to the story of how chip...
Santa Clara’s Convention Center was home to DesignCon 2019 from January 29-31, 2019. This conference is well known for showing printed circuit board (PCB) and system designers the latest technology advances, enabling higher performance and lower power and lower cost solutions. Bootcamps, tutorials, keynotes, and many in-depth technical sessions offered...
Flanders, New Jersey (March 10, 2015)—Rudolph Technologies, Inc. (NYSE: RTEC) announced today that a major outsourced assembly and test (OSAT) manufacturer has selected the JetStep® Advanced Packaging Lithography System for evaluation. The tool, which ships this week, will be used to develop copper (Cu) pillar bumping and through silicon via...
Glass has many properties that make it an ideal substrate for interposers such as: ultra-high resistivity and low electrical loss, low dielectric constant, and adjustable coefficient of thermal expansion (CTE). Leveraging glass-forming processes such as Corning’s fusion forming process provides roughness < 0.5nm rms, and flat substrates with good stiffness....
