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Veeco Waferstorm

Veeco Waferstorm® Selected by Adeia to Support Next-Gen Advanced Packaging Applications

Veeco WaferStorm® Wet Processing System Installed at Adeia Inc. for Critical Cleaning Processes in Hybrid Bonding lainview, N.Y., March 13, 2024—Veeco Instruments Inc. (NASDAQ: VECO) today announced that Adeia Inc., a leading semiconductor R&D innovator has chosen the Veeco WaferStorm Wet Processing Systems for advanced packaging applications. The system was...

EMIB

Cadence and Intel Foundry Collaborate to Enable Heterogeneous Integration with EMIB Packaging Technology

Cadence and Intel Foundry have collaborated to develop and certify an integrated advanced packaging flow utilizing Embedded Multi-die Interconnect Bridge (EMIB) technology to address the growing complexity in heterogeneously integrated multi-chip(let) architectures. The collaboration enables Intel customers to leverage advanced packaging to accelerate the high-performance computing (HPC), AI, and mobile...

Micross Acquires Technograph Microcircuits Ltd., Expands Portfolio of Packaging and Substrate Capabilities for Multi-Chip-Modules, ASICs and PCBs

Melville, NY (May 2, 2023) – Micross Components (“Micross”), a leading provider of high-reliability microelectronic product and service solutions for aerospace, defense, space, medical, energy, industrial and other applications, today announced the acquisition of Technograph Microcircuits Ltd, (“TechnoGraph” or the “Company”), a leading provider of hybrid integrated circuits, RF &...

IIFTLE 542: What We Need to Know about the US IC Substrate Infrastructure 

The IPC Advanced Packaging Symposium: “Building the IC Substrate and Package Assembly Ecosystem” was held in Washington, DC in October. Being the IPC, we could and should expect the focus to be on high-density laminates (HDI) and high-density build-up substrates (HDBU). Based on the 2021 IPC report “North American Advanced...

Staying Ahead of the Advanced Packaging Technology Curve

Advanced packaging technology enables continued performance scaling across applications, and it is clear that the coming generations of mobile and edge computing, cloud computing, and distributed high-performance computing will require heterogeneous chip integration technologies. To accommodate demanding performance and scaling requirements while also meeting stringent technical specifications for speed, bandwidth,...

IFTLE 481: A BRIDG to Somewhere

It was exactly two years ago that IFTLE first discussed the entity known as BRIDG and how it planned to be a “boutique microelectronics fabrication facility” that would be able to prototype 2.5/3D devices for the U. S. government and the microelectronics community. Later in the year, BRIDG announced that...

Artificial Intelligence: A New Era of the Advanced Packaging Industry

Artificial Intelligence (AI) is driving the development of 3D TSV and heterogeneous integration technologies. With its new 3D TSV & 2.5D business update report, Yole Développement (Yole), part of Yole Group of Companies investigates the advanced packaging industry and takes a closer look at the AI impact on this market....

Executive Viewpoint: Invensas Opens its Toolbox of Interconnect Options

We’ve heard it expressed many times whenever there’s a new interconnect technology vying for adoption: manufacturers will select the best performing option at the lowest cost to do the job. However, as performance requirements reach previously un-anticipated levels, pitch requirements become tighter, and density requirements become higher, the job of...