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IFTLE has spent significant time discussing the lack of U.S.-based substrate manufacturing. Although packages such as the ball-grid array (BGA) were invented by U.S. companies like Motorola, production capacity was all off-shored to Asia years ago. Having competent U.S. production capacity has always been part of the US reshoring program....
Melville, NY (May 2, 2023) – Micross Components (“Micross”), a leading provider of high-reliability microelectronic product and service solutions for aerospace, defense, space, medical, energy, industrial and other applications, today announced the acquisition of Technograph Microcircuits Ltd, (“TechnoGraph” or the “Company”), a leading provider of hybrid integrated circuits, RF &...
Co-presenting “Photonic Debonding for Wafer–Level Packaging” at CS MANTECH, held May 15-18 in Orlando, FL. Orlando, Florida – April 25, 2023 – Brewer Science, Inc. and PulseForge, Inc. bring substantial cost savings, increased throughput, and other benefits with photonic debonding to semiconductor advanced packaging. This collaboration combines a global leader in manufacturing next-generation materials and...
Santee, Calif. — StratEdge Corporation,leader in the design, production, and assembly of high-frequency and high-power semiconductor packages for RF, microwave, and millimeter-wave devices, will display its molded ceramic packages at the IMAPS Device Packaging, APEC, and GOMACTech conferences, all of which are being held in March. The molded ceramic packages can...
The Most Comprehensive Program for Microelectronics and Advanced Packaging This Spring The 19th Annual Device Packaging Conference (DPC 2023) will be held March 13-16, 2023, at the WeKoPa Resort and Conference Center in Fountain Hills, Arizona. This esteemed event brings together industry engineers, researchers and top experts involved in advanced packaging and microelectronics assembly with...
Leading-edge semiconductor fabs haven’t been built in the U.S. for a while but that’s about to change. Let’s look at how and where those changes will take place. It is certainly worth reviewing such information because these fabs will be driving the matching advanced packaging that will also be installed...
JISSO JOINT consortium In late 2019 Showa Denko bought Hitachi Chemical (HC) for about $8.9B. HC had an operating income of about $440 million on sales of $6.3B with about 40% of its sales from materials, including chemical mechanical planarization slurries, epoxy compounds, and anode materials for lithium-ion batteries. The...
In IFTLE 441, (published in February before we were paying attention to the pandemic and the devastation to the world economy that it has brought) we discussed the desire of the US Government to have on-shore, state-of-the-art (SOTA) microelectronics sources. Recently amid pressure from the US, TSMC announced preliminary plans to...
As packaging practitioners/experts themselves, regular readers know that IFTLE is always on the lookout for the latest applications and the latest chips going into those applications because all those chips will have to be packaged. However, IFTLE has previously warned the reader to beware of technology hype, which appears to...
Glass has many properties that make it an ideal substrate for interposers such as: ultra-high resistivity and low electrical loss, low dielectric constant, and adjustable coefficient of thermal expansion (CTE). Leveraging glass-forming processes such as Corning’s fusion forming process provides roughness < 0.5nm rms, and flat substrates with good stiffness....
