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Brewer Science and PulseForge Bring Photonic Debonding to Semiconductor Advanced Packaging at Scale

Apr 25, 2023

Co-presenting “Photonic Debonding for Wafer–Level Packaging” at CS MANTECH, held May 15-18 in Orlando, FL. Orlando, Florida – April 25, 2023 – Brewer Science, Inc. and PulseForge, Inc. bring substantial cost savings, increased throughput, and other benefits with photonic debonding to semiconductor advanced packaging. This collaboration combines a global leader in manufacturing next-generation materials and...

IMAPS Device Packaging Conference Returns to Arizona in March 2023

Jan 09, 2023

The Most Comprehensive Program for Microelectronics and Advanced Packaging This Spring The 19th Annual Device Packaging Conference (DPC 2023) will be held March 13-16, 2023, at the WeKoPa Resort and Conference Center in Fountain Hills, Arizona.   This esteemed event brings together industry engineers, researchers and top experts involved in advanced packaging and microelectronics assembly with...

Mercury Systems Selected to Provide Secure Packaging for DoD SHIP Program

Apr 19, 2022

ANDOVER, Mass., April 19, 2022 (GLOBE NEWSWIRE) — Mercury Systems, Inc. (NASDAQ: MRCY, www.mrcy.com), a leader in trusted, secure mission-critical technologies for aerospace and defense, announced it has been selected to provide trusted and secure advanced packaging for the Office of the Undersecretary of Defense for Research and Engineering’s (OUSD...

IFTLE 455: Advanced Microelectronics is Coming Home

Jul 09, 2020

In IFTLE 441, (published in February before we were paying attention to the pandemic and the devastation to the world economy that it has brought) we discussed the desire of the US Government to have on-shore, state-of-the-art (SOTA) microelectronics sources. Recently amid pressure from the US, TSMC announced preliminary plans to...

Artificial Intelligence: A New Era of the Advanced Packaging Industry

Jun 08, 2017

Artificial Intelligence (AI) is driving the development of 3D TSV and heterogeneous integration technologies. With its new 3D TSV & 2.5D business update report, Yole Développement (Yole), part of Yole Group of Companies investigates the advanced packaging industry and takes a closer look at the AI impact on this market....

MEPTEC Roadmap 2016: Best Time in History to be in the Packaging Business

Nov 21, 2016

With nary a farewell glance in the rearview mirror at the terrain successfully covered over the decades during which we followed the ITRS’ Guide Michelin; the new Heterogeneous Integration Roadmap gives us eyes on what comes next. It looks from here-and-now all the way to a horizon that extends, like...

Will the Chip Industry Benefit from the Internet of Everything?

Jun 02, 2015

The Internet of Things (IoT)  or as Cisco calls it, the Internet of Everything, has been the theme du jour for almost every semiconductor-related industry event in the past year, and going forward for 2015. The IoT hype continues, as many see the opportunity in this global trend to connect people,...

Is Complex Packaging in High Volume Manufacturing (HVM)?

Mar 20, 2015

Over the past year… The amount of 2.5/3D articles published has gained momentum. Some articles discuss when HVM will be achieved for this complex packaging, others discuss costs from chip to system levels, how to evaluate options, design and verify, etc. All articles are based on facts gleaned from various articles, presentations...

Invensas Acquires ALLVIA 3D-IC Packaging Technology

Jan 11, 2011

Invensas Corporation, a wholly owned subsidiary of Tessera Technologies, Inc. , announced today that it has acquired the patent assets of ALLVIA, Inc. In addition, Invensas has entered into a two-year collaborative partnership with ALLVIA to further develop technology and intellectual property (IP) in the 3-dimensional integrated circuit (3D-IC) packaging...