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ERS electronic Introduces “High Power Dissipation” Thermal Chuck System, Which Can Dissipate up to 2.5kW at -40°C for Embedded Processors, DRAM and NAND Wafer Test

Nov 15, 2023

MUNICH, Nov. 14, 2023 /PRNewswire/ — ERS electronic, the industry leader in the market of thermal management solutions for semiconductor manufacturing, is introducing its latest “High Power Dissipation” Thermal Chuck System. The technology enables accurate and powerful temperature control of a DUT while performing tests of high-end CPUs, GPUs, and...

ESTC 2022 from September 13-16, 2022, in Sibiu, Romania – Register now!

Aug 18, 2022

The 9th ELECTRONICS SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE (ESTC 2022) will take place in-person in Sibiu (Hermannstadt), Romania, in less than a month. ESTC is the single largest semiconductor packaging conference in Europe and a premier international event in the field of electronics packaging and system integration. The conference is organized every...

Dedicated High‑Volume Advanced Packaging Facility, First in US, Announced by NHanced Semiconductors

Jun 15, 2021

AP foundry production to increase by 20x in 2022 NHanced Semiconductors is expanding the cleanroom of its North Carolina foundry to house a new high-volume line of advanced packaging (AP) equipment. The new line – the first of its kind in the US – will run in parallel with the...

KLA Launches Electronics, Packaging and Components Group

May 26, 2020

New Business Group Targets Growth Opportunities in Fast-Growing Sectors KLA Corporation (NASDAQ: KLAC) today announced the formation of a new business group focused on growth in its Electronics, Packaging and Components (EPC) businesses. Under the leadership of KLA Executive Vice President Oreste Donzella, the EPC group extends KLA’s leadership in...

NORDSON Dage: XM8000 Wafer X-ray Metrology Platform

May 12, 2014

Fully automatic, in-line X-ray metrology platform for the measurement and defect capture of both optically hidden and visible features in wafers and 2.5D/3D IC packages. Available measurements include voiding, via fill, overlay and critical dimensions in TSVs, wafer bumps and MEMS. Testimonial: The XM8000 Wafer Metrology Platform provides a new...

Cascade Microtech: In the imec 3D Test Lab

Apr 07, 2014

My visit to imec to meet with the Cascade Micorotech and imec 3D Test collaboration team included a tour of the 3D test lab to see the CM300 in action, so we suited up for Class 1000 cleanroom and stepped inside. Generally we would have had to prep for class...

The Back Story on Besang’s True 3D ICs

Nov 07, 2013

BeSang Inc, a fabless semiconductor company in Beaverton, OR, has been on my 3D IC radar since 2008, when I first edited a 3D technology cover feature in Advanced Packaging Magazine, written by George C. Riley, that included a status report on BeSang’s TRUE 3D ICs™, which had just been...

Dow Corning Joins EV Group’s Open Platform for Temporary Bonding Materials for 3D-IC Manufacturing

Sep 04, 2013

Both Innovators Join Forces to Offer Simple, Cost-Effective Temporary Bonding/Debonding Solution for High-Performance 3D-IC Packaging ST. FLORIAN, Austria, Sept. 3, 2013 — EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, announced today that Dow Corning has joined its network...

Imbera takes on 3D packaging supply chain issues

Dec 12, 2012

While 3D IC integration folks are still scratching their heads trying to determine who will take on post-fab processes, over in the 3D packaging world Imbera has taken ownership of the supply chain issues facing the OSATS-to-PCB assembly end of the line for embedded active and passive technologies.

ECTC 2011 – It’s a Small World After All

Jun 13, 2011

I ask you, could there be a better place to host a conference dedicated to micro and nano electronics than Disney World, the place where all things are possible? This year’s event boasted the greatest turnout so far, (over 1000 attendees) and had such an abundance of papers that the...