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Die-to-Wafer hybrid bonding: 4 stacked chips per filed Test vehicle example at CEA-Leti

Expanding the Chiplet Market: Processing Any Wafer from Any Foundry

In response to the rising costs of advanced nodes and the slowdown of Moore’s Law, major vendors – AMD, Intel, Apple, and Samsung – are making the shift towards chiplet-based systems using 3D technologies, which create novel system partitioning through modular and scalable architectures. These solutions optimize bandwidth with respect...

Breakthroughs in 3D Stacked FinFETS and 3D Sequential Integration

The annual International Electron Devices Meeting (IEDM) presents the latest developments in electronic device technologies focused on advanced scaling, heterogeneous integration, quantum computing, and wide bandgap devices. Among several excellent papers on 3D integration were two papers on 3D sequential integration, long the holy grail of 3D integration because of...

Hybrid Bonding: From Concept to Commercialization

Hybrid bonding is quickly becoming recognized as the preferred permanent bonding path for forming high-density interconnects in heterogeneous integration applications, from 2DS enhanced, to 3D stacking with or without through silicon vias (TSVs), as well as MEMS and III-V applications. In this exclusive interview with Gill Fountain, Xperi, winner of...

The X-ray Metrology of TSVs and Wafer Bumps

Being able to look inside an object without opening it up or destroying it, and separating the different features within that would otherwise overlap each other when seen in a standard 2D X-ray image, are the same for the needs of electronics inspection on wafers and on printed circuit boards,...

SUSS MicroTec launches platform for permanent wafer bonding, debonding and cleaning

SUSS MicroTec,supplier of equipment and process solutions for the semiconductor and related markets, launched the XBC300 Gen2, a high volume manufacturing platform for advanced 3D processing. The new bonding equipment can be used for permanent wafer bonding, or debonding and cleaning of 200mm and 300mm wafers. It is designed for...

Rudolph Fulfills Multiple System Orders for TSV Inspection and Metrology

Rudolph Technologies, Inc., provider of process characterization equipment and software for the semiconductor, solar and LED industries, announced today that it has shipped its Wafer Scanner™ 3880 3D Inspection System, multiple NSX® Macro Defect Inspection Systems and its Discover® Yield Management Software Suite to a leading semiconductor manufacturer for use...

3D InCites’ Guide to Navigating theThird Dimension at SEMICON West

There’s no doubt about it, the 3D technology related workshops, lectures, and presentations happening at and around SEMICON West this year are plentiful and varied. There’s something for everyone: 3D metrology, 3D interconnect and standards development; 3D IC co-design, 3D bonding and thin wafer handling, 3D test solutions, commercialization of...