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ERS electronic Introduces “High Power Dissipation” Thermal Chuck System, Which Can Dissipate up to 2.5kW at -40°C for Embedded Processors, DRAM and NAND Wafer Test

Nov 15, 2023

MUNICH, Nov. 14, 2023 /PRNewswire/ — ERS electronic, the industry leader in the market of thermal management solutions for semiconductor manufacturing, is introducing its latest “High Power Dissipation” Thermal Chuck System. The technology enables accurate and powerful temperature control of a DUT while performing tests of high-end CPUs, GPUs, and...

KLA Launches Electronics, Packaging and Components Group

May 26, 2020

New Business Group Targets Growth Opportunities in Fast-Growing Sectors KLA Corporation (NASDAQ: KLAC) today announced the formation of a new business group focused on growth in its Electronics, Packaging and Components (EPC) businesses. Under the leadership of KLA Executive Vice President Oreste Donzella, the EPC group extends KLA’s leadership in...

NORDSON Dage: XM8000 Wafer X-ray Metrology Platform

May 12, 2014

Fully automatic, in-line X-ray metrology platform for the measurement and defect capture of both optically hidden and visible features in wafers and 2.5D/3D IC packages. Available measurements include voiding, via fill, overlay and critical dimensions in TSVs, wafer bumps and MEMS. Testimonial: The XM8000 Wafer Metrology Platform provides a new...

3D Test

Cascade Microtech: In the imec 3D Test Lab

Apr 07, 2014

My visit to imec to meet with the Cascade Micorotech and imec 3D Test collaboration team included a tour of the 3D test lab to see the CM300 in action, so we suited up for Class 1000 cleanroom and stepped inside. Generally we would have had to prep for class...

The Back Story on Besang’s True 3D ICs

Nov 07, 2013

BeSang Inc, a fabless semiconductor company in Beaverton, OR, has been on my 3D IC radar since 2008, when I first edited a 3D technology cover feature in Advanced Packaging Magazine, written by George C. Riley, that included a status report on BeSang’s TRUE 3D ICs™, which had just been...

SUSS MicroTec launches platform for permanent wafer bonding, debonding and cleaning

Jun 02, 2012

SUSS MicroTec,supplier of equipment and process solutions for the semiconductor and related markets, launched the XBC300 Gen2, a high volume manufacturing platform for advanced 3D processing. The new bonding equipment can be used for permanent wafer bonding, or debonding and cleaning of 200mm and 300mm wafers. It is designed for...

ECTC 2011 – It’s a Small World After All

Jun 13, 2011

I ask you, could there be a better place to host a conference dedicated to micro and nano electronics than Disney World, the place where all things are possible? This year’s event boasted the greatest turnout so far, (over 1000 attendees) and had such an abundance of papers that the...

Rudolph Fulfills Multiple System Orders for TSV Inspection and Metrology

Mar 10, 2011

Rudolph Technologies, Inc., provider of process characterization equipment and software for the semiconductor, solar and LED industries, announced today that it has shipped its Wafer Scanner™ 3880 3D Inspection System, multiple NSX® Macro Defect Inspection Systems and its Discover® Yield Management Software Suite to a leading semiconductor manufacturer for use...

3D InCites’ Guide to Navigating theThird Dimension at SEMICON West

Feb 07, 2010

There’s no doubt about it, the 3D technology related workshops, lectures, and presentations happening at and around SEMICON West this year are plentiful and varied. There’s something for everyone: 3D metrology, 3D interconnect and standards development; 3D IC co-design, 3D bonding and thin wafer handling, 3D test solutions, commercialization of...