Matches for your search: "fan-out wafer level packaging "
EV Group and Fraunhofer IZM-ASSID partnership kicks off with the installation of EVG850 automated laser debonding system at the newly launched Center for Advanced CMOS and Heterointegration Saxony (CEASAX) EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, and Fraunhofer...
2024 is a big year for 3D InCites members at the Electronic Components and Technology Conference (ECTC). With 34 of our community member companies presenting, exhibiting, and in some cases both, this may be our most well-represented year yet! ECTC 2024 is packed with program sessions, interactive presentations, and special...
CHIPS Act Innovation Hubs SEMI has published an interesting article where they predict 10 likely locations for CHIPS Act Innovation Hubs. Aside from the CHIPS Acts $52B in subsidies for American chipmakers and 25% tax credits for capital expenditures, the Department of Commerce is also allocating $10B (over five years)...
I have a confession to make. Last March – we’re talking March of 2023 at IMAPS DPC – Beth Keser, IMAPS president, presented me with a signed copy of the book she co-edited with Steffen Khröhnert – Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces:...
Continuing our look at presentations at the 2022 ECTC, who better to examine the question “Panel Level Packaging – Where are the Technology Limits?” than Tanja Braun and the group at IZM Fraunhofer who have become experts in this processing area over the last several years? Although they do not...
In recent years, there has been an increased focus on fan-out wafer-level packaging (FOWLP) due to the smaller packaging size requirements for smartphones and handheld electronic devices. FOWLP – and fan-out panel-level packaging (FOPLP) – is the process during which known good dies (KGD) from the original silicon wafer are...
The keynotes outlined in Part 1 of IMAPS DPC 2017 Covers Range of High-tech Topics, including EDA were obviously very important, but a relatively small part of the entire conference. After the two keynotes on Tuesday morning, I listened to YOLE’s presentation, delivered by Santosh Kumar, and learned that the...
Over the past few years, it becomes clear that some panel-level packaging choices will be more suitable than others for successful commercial development. So, when will the panel-level packaging industry take off? How will it evolve? “At Yole, we’ve identified five key packaging platforms that can be processed on a...
Now that we’ve determined that advanced wafer level packaging — including embedded technologies, fan-out wafer level packaging, and 3D packaging — add value to the devices in which they are implemented, the next step is understanding which option offers the best cost/performance ratio for specific product applications. One of the...
For quite some time on 3D InCites, we’ve talked about how breaking up SoC designs into specific functions not only offers a lower cost of ownership than continued scaling, but also allows for heterogeneous integration of disparate technologies that are manufactured at their optimal nodes and then stacked on an...
