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In response to the rising costs of advanced nodes and the slowdown of Moore’s Law, major vendors – AMD, Intel, Apple, and Samsung – are making the shift towards chiplet-based systems using 3D technologies, which create novel system partitioning through modular and scalable architectures. These solutions optimize bandwidth with respect...
Tokyo Electron (TEL; Head Office: Minato-ku, Tokyo; President: Toshiki Kawai) today announced the launch of Ulucus™ L, a laser edge trimming system for 300ｍｍ wafer-bonded devices. Ulucus L is a laser edge trimming system that integrates an advanced laser control unit with LITHIUS Pro™ Z, TEL’s widely recognized coater/developer platform....
ST. FLORIAN, Austria, January 18, 2022—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the EVG®7300 automated SmartNIL® nanoimprint and wafer-level optics system. The EVG7300 is the company’s most advanced solution to combine multiple UV-based process capabilities, such...
The annual International Electron Devices Meeting (IEDM) presents the latest developments in electronic device technologies focused on advanced scaling, heterogeneous integration, quantum computing, and wide bandgap devices. Among several excellent papers on 3D integration were two papers on 3D sequential integration, long the holy grail of 3D integration because of...
Hybrid bonding is quickly becoming recognized as the preferred permanent bonding path for forming high-density interconnects in heterogeneous integration applications, from 2DS enhanced, to 3D stacking with or without through silicon vias (TSVs), as well as MEMS and III-V applications. In this exclusive interview with Gill Fountain, Xperi, winner of...
The initial shock of a major earthquake lasts just a short time, tens of seconds, although it can seem forever for those trapped by its shaking. A tsunami wave train lasts minutes to hours before ocean waters re-stabilize after their initial disturbance. But the persistence of radiological disasters is measured...
Being able to look inside an object without opening it up or destroying it, and separating the different features within that would otherwise overlap each other when seen in a standard 2D X-ray image, are the same for the needs of electronics inspection on wafers and on printed circuit boards,...
Two schools of thought clearly emerged at last week’s European 3D TSV Summit, which took place on January 20 and 21, 2014 at Minatec campus in Grenoble France. One I addressed in yesterday’s post – about realizing system-level benefits – including cost – by integrating 2.5D and 3D IC technologies....
In the world of semiconductors and microelectronics, a trend to vertically stack integrated circuits (ICs) or circuitry has emerged as a viable solution for meeting electronic device requirements such as higher performance, increased functionality, lower power consumption, and a smaller footprint. The various methods and processes used to achieve this...
