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In electronic product design, solely relying on process shrink as the primary driver of product innovation and improved system performance is no longer a viable approach. The cost and complexity associated with advanced nodes have everyone looking for alternatives to the traditional monolithic system-on-chip (SoC). The path most is taking...
TechSearch International’s latest report: 2022 Flip Chip and WLP: Trends and Market Forecasts examines the impact of slowing consumer demand on the flip chip and WLP market growth. The report includes an examination of both fan-in WLP and fan-out WLP markets. The report also examines bump pitch trends and the...
In the era of more-than-Moore, 3D IC is the new scaling approach adopted by the marketplace. Progress has been made throughout the semiconductor ecosystem in bringing 3D ICs designs to the mainstream, including design-for-test (DFT). First came 2.5D Design-for-test The industry got some practice for the challenges of 3D IC...
Chiplets are the new “It” heterogeneous integration technology. In fact, the big news in Taiwan this week is that Apple is entertaining the idea of using TSMC’s 3D interconnect fabric – which is based on the company’s approach to chiplet integration. According to Taiwan News, other companies considering the technology...
Let’s take a final look at some of the presentations from the 2021 IMAPS Device Packaging workshop. Applied Materials Applied Materials (AMAT) discussed “Through Silicon Vias (TSVs) and Hybrid Bonding Solutions for Heterogeneous Integration…”. AMAT notes that hybrid bonding is not a new technology but rather has been commercialized for...
Siemens Digital Industries Software today announced that its collaboration with Advanced Semiconductor Engineering, Inc. (ASE) has generated two new enablement solutions engineered to help mutual customers create and evaluate multiple complex integrated circuit (IC) package assemblies and interconnect scenarios in an easy-to-use, data-robust graphical environment prior to and during physical...
This year’s SEMI 3D & Systems Summit was held in late January in Dresden. In the next few blogs, we will take a look at some of the interesting material that was presented. Savansys Activity-based Cost Modeling Amy Lujan from Savansys discussed their activity-based cost modeling of a chip on...
Over the years on 3D inCites, we’ve discussed the debate about the advantages and disadvantages of using glass substrates for advanced packaging applications. Thanks to ongoing research and development, a clear path has emerged for the use of glass in two key areas: as carrier substrates for high-density fan-out (FO)...
The cynic inside often thinks “All hat, no cattle” about the newest new, new thing (right, Michael Lewis?). But if you were to consult the Gartner Hype Cycle listings from 2008 as I just did you would find, perhaps to your surprise, that Cloud Computing, 3-D Printing, Solid-State Drives, and...
The Computer History Museum in Mountain View is a very impressive place to show you the enormous progress ICs and Electronic Systems have made in the most recent 50+ years. What I like even more is the fact that an increasing number of high-tech companies and industry organizations are utilizing...
