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SUNNYVALE, Calif., Oct 3rd, 2023 – Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711), today announced the launch of its Integrated Design Ecosystem™ (IDE), a collaborative design toolset optimized to systematically boost advanced package architecture across its VIPack™ platform. This innovative...
To satisfy industry demand for continued increases in electronic functions per unit area, foundries and outsourced assembly and test (OSAT) companies have shifted their emphasis to driving advanced IC packaging innovation. One path is to integrate, in the package, smaller, heterogeneous, or homogeneous, high-yield chips or chiplets: functional building blocks...
As I listened to keynote speakers and panelists at the recent 2022 IMAPS Advanced SiP Conference talk about the commercialization of chiplet technologies, I felt a sense of déjà vu. The key takeaways of the talks and panel discussions sounded eerily familiar. And then it hit me: these were the...
Amkor Technology, Inc. (NASDAQ: AMKR), a leading provider of semiconductor packaging and test services, today announced that it plans to build a state-of-the-art smart factory in Bac Ninh, Vietnam. The first phase of the new factory will focus on providing Advanced System in Package (SiP) assembly and test solutions to...
Continuing our coverage of ECTC 2021, let’s take a look at the session on Heterogeneous Integration (HI) using 2.XD/3D packaging, chaired by Subash Shinde of Notre Dame and John Knickerbocker of IBM. IBM Introduces Direct Bonded HI Si Bridge Technology Though they are not manufacturing chips or packages anymore, IBM...
Much has been written about the end of Dennard Scaling, the slowdown of Moore’s Law and the impact that these events will have on future semiconductor performance and technologies.[1] Much has also been written about semiconductor performance improvements that advanced IC packages are expected to provide that previously resulted from...
As it does each year, TSMC recently brought 45 of its ecosystem partners together for its annual Open Innovation Platform® Forum to demonstrate to joint customers the value of a well-managed IC design and manufacturing ecosystem. TSMC and many of the partners presented recent accomplishments and explained in 33 technical...
Whenever Francoise organizes an event, she always manages to compose a mixture of entertainment, real work and valuable education. This panel was no different. Francoise moderated the IWLPC 2015 Panel Discussion: Interposers, 3D TSVs, and Alternatives: What are the Options and Where do They Fit? featuring Aric Shorey, Corning, Inc.; Thibeault Buisson, Yole...
A second side trip on the way to DATE 2015 brought me back to Nimes, France to check up on activities at Fogale Nanotech since last year. I was reminded once again, that Fogale isn’t just a semiconductor equipment supplier. Its core competencies are optical and capacitive sensing technologies, and thanks to...
“Keeping busy” doesn’t begin to describe what’s happening at EV Group these days. I sat down with Markus Wimplinger, Corporate Technology Development and IP Director, EVG, at SEMICON West for a full briefing of the company’s latest corporate and technology developments. Remaining true to their mission of “invent, innovate, implement”...
