Matches for your search: "fan-out wafer level packaging "
If you have been following the announcements from Bob Patti and his company, NHanced Semiconductors, it would not be surprising if you were a bit confused about how all these announcements will be coming together. I know IFTLE was, so we approached longtime friend Bob Patti and came up with...
MRSI Systems (a part of Mycronic Group), a leading manufacturer of fully automated, high-precision, high-speed, flexible die bonding and epoxy dispensing systems, has launched the MRSI-705HF high-force die bonder, a new variant of the proven MRSI-705 platform. The MRSI-705HF is equipped with a heated bond head that can apply up...
Company leverages its extensive experience in single wet wafer cleans to enter post-CMP cleaning market FREMONT, Calif., July 12, 2022 (GLOBE NEWSWIRE) — ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) applications, today announced the introduction of its new...
ACM’s Ultra C VI Tool Supports Most Semiconductor Clean Processes for Advanced Logic, DRAM and 3D NAND Manufacturing; Provides 50% More Throughput Than 12 Chamber Tool FREMONT, Calif., April 21, 2022 (GLOBE NEWSWIRE) — ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level...
Chandler, Arizona, USA, February 12th, 2020 – Axus Technology (Axus), a leading global provider of CMP, wafer thinning and wafer surface processing solutions for semiconductor applications, is excited to be working with Mosaic Microsystems to build the supply chain for thin glass and through-glass via (TGV) processing and heterogeneous microelectronic...
While we wait in the 3D IC holding pattern for products to go into high volume, processes continue to be tweaked and optimized to address the remaining 3D IC assembly challenges. At IMAPS DPC 2015, a number of presentations focused on some of these incremental advancements. Here, we checked in with...
3D integration has created a complex landscape of many different package architectures and integration approaches that have diverse materials needs and uncertain insertion timing. The multitude of processes required do not fit neatly into the established pigeonholes of front-end and back-end. Processes such as through silicon via (TSV) fabrication require...
In recent years, 2.5D packaging has quickly gained acceptance as an advanced packaging process, and the first products using this technology are now coming to market.¹ Most estimates project growth for 2.5D interposer packaging faster than the industry as a whole. Similar to the multi-chip modules (MCMs) of the past,...
Permanent wafer bonding can be categorized based on bonding with or without an intermediate layer. Intermediate layers can be subcategorized into insulating layers including glass frit bonding, adhesive bonding, or metallic bonding including Cu-Cu/oxide “hybrid” bonding, solder bonding, and thermo-compression copper-copper bonding as shown in Figure 1. MEMS devices are...
Invent, Innovate, Implement continues to be the mantra at EV Group, supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets. In visits I’ve made to EVG’s Schaerding, Austria world headquarters over the years, it’s clear that this Triple I approach is working for the company, which...
