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MRSI Systems (a part of Mycronic Group), a leading manufacturer of fully automated, high-precision, high-speed, flexible die bonding and epoxy dispensing systems, has launched the MRSI-705HF high-force die bonder, a new variant of the proven MRSI-705 platform. The MRSI-705HF is equipped with a heated bond head that can apply up...
Thermal management is becoming an ever more critical challenge for semiconductor devices, as the functional density and power density increase – especially with advanced packaging. Thermal test chips (TTC) are a critical enabler for developing thermal management solutions for high-power semiconductor devices. How are TTCs Fabricated? TTCs made from silicon...
IFTLE thought it might be of value to take a look at the Semiconductor Industry Association’s (SIA) response to the Dept of Commerce’s request for information (RFI) on “Incentives, Infrastructure, and Research and Development Needs to Support a Strong Domestic Semiconductor Industry”, which is being used to plan for and...
In my alliance management roles at electronic design automation (EDA) companies, I arranged many presentations to convey the benefits of EDA tools to IDMs, fabless IC vendors, and wafer foundries. Some of our EDA marketing people passionately presented their products’ strengths and demonstrated in-depth EDA knowledge. However, speaking fast, with...
A live webinar on Recovery and Growth Areas After COVID-19 kicks off virtual programming May 20th. [May 15, 2020 – Research Triangle Park, NC ] — IMAPS is pleased to announce several new series of virtual learning opportunities for the semiconductor packaging industry, including a Global Business Council Live Webinar...
Chiplets and 5G were a kind of buy-in to play at the IMAPS 2019 Symposium high-stakes table last week in Boston, MA, but it was heterogeneous integration that took many a pot during the three days of the symposium, particularly when IBM Research held the HI cards. The quick summary...
This year again, both market segments, high end, and low end, are the main targets of through silicon via (TSV) technology providers. In its latest advanced packaging technology and market analysis entitled 3DIC and 2.5D TSV Interconnect for Advanced Packaging: 2016 Business Update report, Yole Développement (Yole) announces, high volume...
If I had not attended the 2015 3D ASIP conference, my outlook for 2016 would have been less upbeat for complex packaging (2.5/3D). But this conference showed that companies and their development organizations are NOT solely looking towards FinFETS and sub 20nm silicon process nodes to meet their integration, power,...
Dow Corning, supplier of advanced silicon technology and materials to the semiconductor industry, and SUSS MicroTec, supplier of semiconductor processing equipment announced a collaboration on a temporary bonding solution for 3D through-silicon via (TSV) semiconductor packaging. As part of this non-exclusive agreement, the companies are developing a material and equipment...
Keith Cooper, Technology and Development, SET North America reports from ECTC 2010's Medical Device Market Panel, offering a view beyond the packaging lab, into the progress and potential of the medical devices that will benefit from 3D integration technologies. A discussion panel on medical devices opened this year’s Electronic Components...
