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AMD to Adopt Glass Substrates for CPUs Business Korea reports that AMD intends to adopt glass substrates for its ultra-high-performance SiPs between 2025 and 2026. AMD reportedly will use glass substrates for its data center products aimed at artificial intelligence (AI) and high-performance computing (HPC) workloads. Performance requirements for AI...
EV Group’s LITHOSCALE® maskless exposure solution is ideally suited for fine-pitch probe cards, which involve complex designs and product mixes that drive up mask overhead costs ASAN-SI, Chungcheongnam-Do, South Korea, January 23, 2024—PROTEC MEMS Technology (PMT), one of the world’s leading suppliers of semiconductor wafer probe cards, has ordered a...
Plasma dicing offers an optimized approach to die singulation as chips get smaller, thinner, and more complex. As semiconductor content proliferates across networks and devices, there’s a growing demand for increased semiconductor functionality packed into smaller, thinner, and stronger packages. Heterogenous integration is essential to this effort and die-to-wafer (D2W)...
FREMONT, Calif., Oct. 18, 2021 (GLOBE NEWSWIRE) — ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) applications, today announced the receipt of an evaluation tool order for its Ultra C SAPS frontside cleaning tool from a major global...
Wet process offers edge etch and clean to improve wafer yield with high throughput and low chemical consumption; First tool expected to ship during third quarter of 2021 FREMONT, Calif., Aug. 05, 2021 (GLOBE NEWSWIRE) — ACM Research, Inc. (“ACM”) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for...
Yesterday at the pre-conference symposium for 3D Architectures for Semiconductor Integration and Packaging (3D ASIP), I was fortunate to get an up close and personal tutorial preview by David Wang, CEO of ACM Research, on the tool manufacturer’s latest process solution for two critical points in the TSV fabrication process. The...
Enhanced Hardware, Software and Process Control Capabilities Enable Two-fold Increase in Throughput to Meet Productivity and Yield Requirements of Today’s 3D IC Manufacturers St. Florian, Austria, July 3, 2012 — EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today...
EVG's EZR® (Edge Zone Release) and EZD® (Edge Zone Debond) Modules Enable Flexible Choice of Adhesives ST. FLORIAN, Austria, October 26, 2011 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has launched a suite...
JDA to Extend Limits of Temporary Bonding/Debonding Technology to Support High-Topography Wafers and Chips SEMICON EUROPA, Dresden, Germany, October 11, 2011—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has established an agreement with world-renowned research...
Brewer Science, Inc., the inventor of ZoneBOND™ technology and world leading expert in materials and processes for thin wafer handling, and SUSS MicroTec, a leading supplier of equipment, are joining forces in commercializing ZoneBOND™ technology for thin wafer handling. SUSS MicroTec, market leader in room temperature debonding process equipment, is...
