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Plasma Dicing Enables Challenging Applications Including D2W Hybrid Bonding

Plasma dicing offers an optimized approach to die singulation as chips get smaller, thinner, and more complex. As semiconductor content proliferates across networks and devices, there’s a growing demand for increased semiconductor functionality packed into smaller, thinner, and stronger packages. Heterogenous integration is essential to this effort and die-to-wafer (D2W)...

ACM Research team at 3D ASIP 2012.

ACM Research: New Kid on the 3D Block

Yesterday at the pre-conference symposium for 3D Architectures for Semiconductor Integration and Packaging (3D ASIP), I was fortunate to get an up close and personal tutorial preview by David Wang, CEO of ACM Research, on the tool manufacturer’s latest process solution for two critical points in the TSV fabrication process. The...

EV Group and Fraunhofer IZM-ASSID Establish Joint Development Agreement for High-Volume 3D Integration Applications

JDA to Extend Limits of Temporary Bonding/Debonding Technology to Support High-Topography Wafers and Chips  SEMICON EUROPA, Dresden, Germany, October 11, 2011—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has established an agreement with world-renowned research...