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ERS electronic Releases Fully Automatic Luminex Machines with PhotoThermal Debonding and Wafer Cleaning

May 29, 2024

ERS electronic, the industry leader in thermal management solutions for semiconductor manufacturing, is announcing two new fully automatic machines from its Luminex product line. The machines, LUM300A1 and LUM300A2, are designed to handle 300 mm substrates, and both feature ERS’s state-of-the-art PhotoThermal debonding technology that offers unparalleled flexibility, cost-effectiveness, and...

IFTLE 526: NIST Funds SEMI/UCLA CHIPS HIR Roadmap; China Dumps US Computers

Jul 13, 2022

Another Heterogeneous Integration Roadmap The UCLA Center for Heterogeneous Integration and Performance Scaling (UCLA CHIPS) and SEMI have announced that they have been awarded a $0.3MM grant from NIST to produce a roadmap for advancing heterogeneous integration and advanced packaging technologies in the US. This is one of the first awards by NIST’s Advanced Manufacturing...

How Europe Should Navigate Its Semiconductor Supply Chain Challenges

Sep 09, 2021

Over the last 18 months, the European semiconductor industry has felt the repercussions of supply chain interruptions due COVID 19 and trade wars, combined with exploding global demand for chips driven by the digital transformation. There are also questions about regional sovereignty and the need to strengthen the local supply...

3D InCites and IMAPS International Partner to Co-host the 2018 3DInCites Awards at the 2018 IMAPS Device Packaging Conference

Dec 06, 2017

Burlingame, California – Dec. 6, 2018 – 3D InCites, the premier content platform for heterogeneous integration technologies, today from the 2017 3D ASIP Conference, announced a collaboration with IMAPS International to co-host the 2018 3D InCites Awards, the semiconductor industry’s most prestigious award program recognizing contributions for the development of...

Amkor Opens MEMS Packaging Line in China

Jun 28, 2016

TEMPE, Ariz., June 28, 2016 – Driven by the increase in global demand for sensors from the smartphone and automotive markets, Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, today announced it is ramping up a new MEMS and sensor packaging line at its...

Addressing 3D IC Assembly Challenges at IMAPS DPC 2015

Apr 02, 2015

While we wait in the 3D IC holding pattern for products to go into high volume, processes continue to be tweaked and optimized to address the remaining 3D IC assembly challenges. At IMAPS DPC 2015, a number of presentations focused on some of these incremental advancements. Here, we checked in with...

Addressing 3D Integration Challenges: Designing Materials for a Complex Landscape

Sep 25, 2014

3D integration has created a complex landscape of many different package architectures and integration approaches that have diverse materials needs and uncertain insertion timing. The multitude of processes required do not fit neatly into the established pigeonholes of front-end and back-end. Processes such as through silicon via (TSV) fabrication require...