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Figure 4 Feature photo above: Ian Cutress of More than Moore moderated a panel discussion including Terrence Lee of Applied Materials, Johanna Swan of Intel, Deepak Kulkarni of AMD, and Kam Kittrell of Cadence. (Source Applied Materials).

3D Integration Themes Become a Reality at IEDM 2024

The Transistor Wars are back, but they look a little different this time. I’ve been attending the IEDM conference off and on for 30ish years. If you are in the semiconductor process side of the world, this is one of the better conferences to attend to get up to speed...

Low temp hybrid bonding

Brewer Science Presents Low-temp Hybrid Bonding at ECTC 2024

Experience higher integration density and improved performance through hybrid bonding techniques. Denver, Colorado – May 23, 2024 – Brewer Science, Inc., a pioneer in temporary and hybrid bonding materials for the advanced packaging semiconductor industry, is presenting and exhibiting at Electronic Components and Technology Conference (ECTC) May 28th through May 31st, 2024. Challenges for High...

ACM Research Receives Purchase Contract for Ultra ECP ap High-Speed Plating Systems

10 ECP ap tools purchased by top-tier Chinese OSAT to support wafer-level packaging applications FREMONT, Calif., May 06, 2022: ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) applications, today announced that a volume purchase contract has been received from a...

ACM Research Receives Orders for Ultra ECP map and Ultra ECP ap Copper Plating Systems

21 ECP tools ordered by top-tier Chinese foundry and multiple advanced package houses FREMONT, Calif., Feb. 17, 2022 (GLOBE NEWSWIRE) — ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) applications, today announced purchase orders for 13 Ultra ECP...

EV Group Unlocks Agile and Efficient Production Scaling with Next-Generation Step-and-Repeat Nanoimprint Lithography System

EVG®770 NT enables large-area master stamp fabrication of complex micro- and nano-structures for augmented reality waveguides, wafer-level optics and advanced biomedical chips EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced the EVG®770 NT—its next-generation step-and-repeat nanoimprint lithography...

Cu-Interposer Drives Connectivity to the Next Level

Plan Optik AG, the leading manufacturer of customized wafers from glass, quartz or glass-silicon compound materials has launched its new Cu-Interposer technology at SEMICON Europa 2019. The progressive miniaturization, increasing integration density, and requirements for more powerful signal routing create the need for 3D integration. Interposer technologies for rewiring have...

EV Group Partners with Plessey to Drive GaN-on-Silicon Monolithic microLED Technology for AR Applications

Plessey, a leading developer of award-winning optoelectronic technology solutions, announces a collaboration with EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, to bring high-performance GaN-on-Silicon (GaN-on-Si) monolithic microLED technology to the mass market. microLEDs are the key optical technology...

IWLPC Best Papers Announced

SMTA and Chip Scale Review magazine announced the best papers from the 2014 International Wafer-Level Packaging Conference (IWLPC.) Winners were selected from each of the three tracks covering Wafer Level Packaging, 3-D (Stacked) Packaging, and MEMS Packaging, as well as an overall Best Paper and Best of Conference winner. IWLPC...

Semi Standards – a 3D conundrum?

I got into an interesting conversation recently with Steve Dwyer, of EV Group, about the puzzling situation 3D IC integration is posing with regard to existing Semi Standards, and those yet to be established as 3D IC integration processes are developed.

Inside CEA-Leti’s 3D Toolbox

Grenoble-based research institute CEA-Leti’s progress is fueled by a single mission: create innovation and transfer it to industry. The goal is to reach marketability within 5 years. As such, Leti’s focus is less on the feasibility of a technology, and more on the probability of that technology being viable in...