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AMD to Adopt Glass Substrates for CPUs Business Korea reports that AMD intends to adopt glass substrates for its ultra-high-performance SiPs between 2025 and 2026. AMD reportedly will use glass substrates for its data center products aimed at artificial intelligence (AI) and high-performance computing (HPC) workloads. Performance requirements for AI...
Experience higher integration density and improved performance through hybrid bonding techniques. Denver, Colorado – May 23, 2024 – Brewer Science, Inc., a pioneer in temporary and hybrid bonding materials for the advanced packaging semiconductor industry, is presenting and exhibiting at Electronic Components and Technology Conference (ECTC) May 28th through May 31st, 2024. Challenges for High...
EV Group’s LITHOSCALE® maskless exposure solution is ideally suited for fine-pitch probe cards, which involve complex designs and product mixes that drive up mask overhead costs ASAN-SI, Chungcheongnam-Do, South Korea, January 23, 2024—PROTEC MEMS Technology (PMT), one of the world’s leading suppliers of semiconductor wafer probe cards, has ordered a...
FREMONT, Calif., Oct. 18, 2021 (GLOBE NEWSWIRE) — ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) applications, today announced the receipt of an evaluation tool order for its Ultra C SAPS frontside cleaning tool from a major global...
Plessey, a leading developer of award-winning optoelectronic technology solutions, announces a collaboration with EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, to bring high-performance GaN-on-Silicon (GaN-on-Si) monolithic microLED technology to the mass market. microLEDs are the key optical technology...
Enhanced Hardware, Software and Process Control Capabilities Enable Two-fold Increase in Throughput to Meet Productivity and Yield Requirements of Today’s 3D IC Manufacturers St. Florian, Austria, July 3, 2012 — EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today...
EVG's EZR® (Edge Zone Release) and EZD® (Edge Zone Debond) Modules Enable Flexible Choice of Adhesives ST. FLORIAN, Austria, October 26, 2011 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has launched a suite...
JDA to Extend Limits of Temporary Bonding/Debonding Technology to Support High-Topography Wafers and Chips SEMICON EUROPA, Dresden, Germany, October 11, 2011—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has established an agreement with world-renowned research...
Brewer Science, Inc., the inventor of ZoneBOND™ technology and world leading expert in materials and processes for thin wafer handling, and SUSS MicroTec, a leading supplier of equipment, are joining forces in commercializing ZoneBOND™ technology for thin wafer handling. SUSS MicroTec, market leader in room temperature debonding process equipment, is...
I got into an interesting conversation recently with Steve Dwyer, of EV Group, about the puzzling situation 3D IC integration is posing with regard to existing Semi Standards, and those yet to be established as 3D IC integration processes are developed.
