Matches for your search: "fan-out wafer level packaging "
Experience higher integration density and improved performance through hybrid bonding techniques. Denver, Colorado – May 23, 2024 – Brewer Science, Inc., a pioneer in temporary and hybrid bonding materials for the advanced packaging semiconductor industry, is presenting and exhibiting at Electronic Components and Technology Conference (ECTC) May 28th through May 31st, 2024. Challenges for High...
Plan Optik AG is excited to introduce Wafer Universe, crafted to meet the urgent needs for standardized wafers with a focus on streamlining procurement and ensuring rapid delivery. Product Offerings: Borofloat33® Glass Wafers: Ideal for a wide range of applications, including Wafer-Level-Packaging (WLP) of MEMS components by anodic bonding. Quartz Glass...
Coronus® DX builds on Lam’s 15-year heritage of innovation in bevel solutions FREMONT, Calif., June 20, 2023 /PRNewswire/ — Lam Research Corp. (Nasdaq: LRCX) today introduced Coronus DX, the industry’s first bevel deposition solution optimized to address key manufacturing challenges in next-generation logic, 3D NAND and advanced packaging applications. As semiconductors...
FREMONT, Calif., Oct. 18, 2021 (GLOBE NEWSWIRE) — ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) applications, today announced the receipt of an evaluation tool order for its Ultra C SAPS frontside cleaning tool from a major global...
Wet process offers edge etch and clean to improve wafer yield with high throughput and low chemical consumption; First tool expected to ship during third quarter of 2021 FREMONT, Calif., Aug. 05, 2021 (GLOBE NEWSWIRE) — ACM Research, Inc. (“ACM”) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for...
Yesterday at the pre-conference symposium for 3D Architectures for Semiconductor Integration and Packaging (3D ASIP), I was fortunate to get an up close and personal tutorial preview by David Wang, CEO of ACM Research, on the tool manufacturer’s latest process solution for two critical points in the TSV fabrication process. The...
Enhanced Hardware, Software and Process Control Capabilities Enable Two-fold Increase in Throughput to Meet Productivity and Yield Requirements of Today’s 3D IC Manufacturers St. Florian, Austria, July 3, 2012 — EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today...
EVG's EZR® (Edge Zone Release) and EZD® (Edge Zone Debond) Modules Enable Flexible Choice of Adhesives ST. FLORIAN, Austria, October 26, 2011 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has launched a suite...
JDA to Extend Limits of Temporary Bonding/Debonding Technology to Support High-Topography Wafers and Chips SEMICON EUROPA, Dresden, Germany, October 11, 2011—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has established an agreement with world-renowned research...
Brewer Science, Inc., the inventor of ZoneBOND™ technology and world leading expert in materials and processes for thin wafer handling, and SUSS MicroTec, a leading supplier of equipment, are joining forces in commercializing ZoneBOND™ technology for thin wafer handling. SUSS MicroTec, market leader in room temperature debonding process equipment, is...
