Matches for your search: "fan-out wafer level packaging "
Last year (IFTLE 512) we discussed the SKC formation of the US subsidiary Absolics, and its glass core substrate manufacturing capabilities. In recent news, Applied Materials recently announced that it will acquire $39 million worth of Absolics shares. Absolics is issuing new shares to raise capital to expand its glass...
10 ECP ap tools purchased by top-tier Chinese OSAT to support wafer-level packaging applications FREMONT, Calif., May 06, 2022: ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) applications, today announced that a volume purchase contract has been received from a...
21 ECP tools ordered by top-tier Chinese foundry and multiple advanced package houses FREMONT, Calif., Feb. 17, 2022 (GLOBE NEWSWIRE) — ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) applications, today announced purchase orders for 13 Ultra ECP...
EVG®770 NT enables large-area master stamp fabrication of complex micro- and nano-structures for augmented reality waveguides, wafer-level optics and advanced biomedical chips EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced the EVG®770 NT—its next-generation step-and-repeat nanoimprint lithography...
Plan Optik AG, the leading manufacturer of customized wafers from glass, quartz or glass-silicon compound materials has launched its new Cu-Interposer technology at SEMICON Europa 2019. The progressive miniaturization, increasing integration density, and requirements for more powerful signal routing create the need for 3D integration. Interposer technologies for rewiring have...
Grenoble, France (November 8, 2018)— UnitySC European leader and a key player in inspection and metrology solutions, today launched the Unity_LIGHTiX ™ system for micro/macro all surface inspection and 2D/3D metrology. This new inspection and metrology system has been designed to address multiple applications including redistribution layers (RDL) down to...
A couple of years ago we may not have predicted that in 2018 there would be a growing demand for high-end chips specifically for global cryptocurrency mining. Those taking part in this search for hashes have a glimmer in their eye similar to those consumed by the hope and frenzy...
SMTA and Chip Scale Review magazine announced the best papers from the 2014 International Wafer-Level Packaging Conference (IWLPC.) Winners were selected from each of the three tracks covering Wafer Level Packaging, 3-D (Stacked) Packaging, and MEMS Packaging, as well as an overall Best Paper and Best of Conference winner. IWLPC...
Sometimes I get so caught up in following the progress of 3D IC with TSV that I lose sight of what else is going on in the 3D space.That is until something like STATS ChipPAC’s announcement that they are ramping to volume production with first-generation eWLB technology hits my inbox....
Grenoble-based research institute CEA-Leti’s progress is fueled by a single mission: create innovation and transfer it to industry. The goal is to reach marketability within 5 years. As such, Leti’s focus is less on the feasibility of a technology, and more on the probability of that technology being viable in...
