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The 3D InCites community members continue to create a buzz with announcements from new acquisitions to industry awards, new product introductions, events, job openings, and more. Here’s a collection of February member highlights. Acquisitions, Partnerships and Collaborations ASE announced a strategic partnership with Infineon Technologies, to acquire two back-end manufacturing...
10 ECP ap tools purchased by top-tier Chinese OSAT to support wafer-level packaging applications FREMONT, Calif., May 06, 2022: ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) applications, today announced that a volume purchase contract has been received from a...
21 ECP tools ordered by top-tier Chinese foundry and multiple advanced package houses FREMONT, Calif., Feb. 17, 2022 (GLOBE NEWSWIRE) — ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) applications, today announced purchase orders for 13 Ultra ECP...
EVG®770 NT enables large-area master stamp fabrication of complex micro- and nano-structures for augmented reality waveguides, wafer-level optics and advanced biomedical chips EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced the EVG®770 NT—its next-generation step-and-repeat nanoimprint lithography...
Leave it to Bill Chen, ASE, to set an optimistic tone for the 2021 Global Business Council Spring Meeting. It was exactly what the packaging community needed to hear. The last time many of us met in person at an industry event was at the 2020 IMAPS Device Packaging Conference...
Plan Optik AG, the leading manufacturer of customized wafers from glass, quartz or glass-silicon compound materials has launched its new Cu-Interposer technology at SEMICON Europa 2019. The progressive miniaturization, increasing integration density, and requirements for more powerful signal routing create the need for 3D integration. Interposer technologies for rewiring have...
Plessey, a leading developer of award-winning optoelectronic technology solutions, announces a collaboration with EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, to bring high-performance GaN-on-Silicon (GaN-on-Si) monolithic microLED technology to the mass market. microLEDs are the key optical technology...
SMTA and Chip Scale Review magazine announced the best papers from the 2014 International Wafer-Level Packaging Conference (IWLPC.) Winners were selected from each of the three tracks covering Wafer Level Packaging, 3-D (Stacked) Packaging, and MEMS Packaging, as well as an overall Best Paper and Best of Conference winner. IWLPC...
I got into an interesting conversation recently with Steve Dwyer, of EV Group, about the puzzling situation 3D IC integration is posing with regard to existing Semi Standards, and those yet to be established as 3D IC integration processes are developed.
Grenoble-based research institute CEA-Leti’s progress is fueled by a single mission: create innovation and transfer it to industry. The goal is to reach marketability within 5 years. As such, Leti’s focus is less on the feasibility of a technology, and more on the probability of that technology being viable in...
