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IMAPS Reshoring Part 2: High-Density Build-Up Substrate Discussions Picking up where we left off in IFTLE 564, the second discussion session was supposed to be focused on the availability of high-density build-up substrates (HDBU) and where we stand in moving production onshore. Jan Vardaman of TechSearch International announced that a...
Semi Analysis has detailed their thoughts on the current GPU shortage. We all know that AI technology is upon us. This will require massive amounts of GPU computing. Semi Analysis recently noted that GPU sales are skyrocketing and they see companies scrambling to stockpile inventory. For example, OpenAI is reporting...
Heterogenous integration in microelectronics requires advanced materials Tapei, Taiwan – September 12, 2022 – Brewer Science, Inc., a global leader in developing and manufacturing next-generation materials and processes for the microelectronics and optoelectronics industries, will present new developments in temporary and permanent bonding material technologies for advanced packaging at SEMICON...
Back from our IFTLE #500 trip down memory lane, let’s continue our look at the SEMI Heterogeneous Integration Summit. We’ll focus on the semiconductor supply chain, the advanced packaging market, and advancements in image sensor technology. Semiconductor Supply Chain Research at BCG Martin Schrems, senior advisor at Boston Consulting Group,...
UMC Becomes #3 Foundry TrendForce reports that UMC is expected to overtake GlobalFoundries as the world’s #3 foundry this quarter (4thQ 2020) reportedly driven by strong demand for display drivers and power management chips. UMC revenue will be US$1.57 billion, with a global market share of 6.9%, compared to GlobalFoundries’...
Several years before I started promoting 3D IC benefits in 2008, a small team of industry visionaries founded the 3D Architectures for Semiconductor Integration and Packaging conference (3D ASIP Conference). Rechristened to 3D Architectures for Heterogeneous Integration and Packaging (still 3D ASIP), each December sees several hundred key players from...
The embedded-die-in-substrate platform has its own history and adoption scheme compared to other advanced packaging platforms, explains Yole Développement (Yole). Indeed while the first significant volume of embedded die in integrated circuit (IC) package substrates came from direct current (DC) converters in smartphones, penetration in other market segments of interest...
There are a some upcoming events in the realm of power electronics that promise to be very interesting and thought provoking for those interested in 3D packaging. Some of the best and brightest minds in the area of 3D packaging (including power electronics 3D packaging technologies) will be present. 3DPEIM is...
Non-contact, non-destructive acoustic technology fulfills growing need in advanced packaging for thick film metrology up to 100μm and void detection down to 0.5μm Flanders, New Jersey (July 21, 2014)—Rudolph Technologies, Inc. (NYSE: RTEC) announced today the availability of its new SONUS™ Technology, designed for measuring thick films and film stacks...
A 3D InCites reader recently inquired whether cost drivers and fine-pitch requirements in 3D applications are moving manufacturers away from flux towards fluxless processes in the bumping steps for both bump formation and assembly.To answer this question, 3D InCites turned to the materials and equipment experts, speaking with Jeff Calvert,...
