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hybrid bonding

The Age of Hybrid Bonding: Where We Are and Where We’re Going

For decades, Moore’s Law has been a way to measure performance gains in the semiconductor industry, but the ability to double the density of transistors on a chip every two years is becoming increasingly challenging. With scaling reaching its limit, manufacturers are looking to advanced packaging innovations to extend the...

Glass Carrier for GaAs Wafer Processing

Gallium arsenide (GaAs) is used in the manufacture of devices such as microwave frequency integrated circuits, monolithic microwave integrated circuits, infrared light-emitting diodes, laser diodes, solar cells, and optical windows. Handling and processing thin GaAs wafers is usually enabled by using a sapphire wafer as a carrier, which is expensive...

Multinational Semiconductor Company Orders Multiple Veeco Wet Processing Systems for Advanced Packaging Applications

Plainview, N.Y., March 17, 2022—Veeco Instruments Inc. (NASDAQ: VECO) today announced that a world- leading semiconductor manufacturer has ordered multiple Veeco WaferStorm® Wet Processing Systems for advanced packaging applications. The systems were chosen due to the low cost of ownership advantage and process performance compared to other platforms. The customer...

The World of Logic as We Know It

October is a busy month as conferences go. ARM and Intel each held their virtual developer events focusing on the future of compute. IMAPS addressed packaging technology, and TSMC held its Open Innovation Platform (OIP) forum, also in late October. AMD followed up with an accelerated data center event in...

The 3D Era is Upon Us

Building integrated circuits (ICs) in the third dimension has been taking place since trench capacitors were introduced for DRAM in the 1980s. The trend continued with the introduction of the damascene process and copper, which quickly grew the back end of the line metallization from 2-3 layers into today’s interconnect...

Carrier Wafers for Semiconductor and MEMS Manufacturing

As technology rapidly moves forward, the reduction of device and chip size is playing an important role in implementing as many chips and sensors in the smallest space. For this reason, the thickness reduction of semiconductor wafers is necessary. Thin semiconductor wafers (thickness around 50-100 µm) are flexible and fragile....

Photolithography Equipment & Materials Market Attracts New Players; Success Not Guaranteed

“Growing photolithography equipment markets in advanced packaging, MEMS and LEDs are attracting new players; but they have to navigate complex roadmaps …” announces Yole Développement (Yole). The “More than Moore” market research and strategy consulting company confirms its leadership in the silicon manufacturing industry with its new technology & market...

Rudolph Technologies and DISCO Corporation Partner to Improve Wafer Saw Process

Flanders, New Jersey (July 14, 2015)—Rudolph Technologies, Inc. (NYSE: RTEC) and DISCO Corporation of Tokyo, Japan, announce a collaborative partnership to deliver leading-edge hardware and software solutions to optimize the wafer saw unit processes. These comprehensive solutions will enable their customers to consistently improve the quality and productivity of their...

SEMATECH Reports Advances in Bond Process for 3D Integration Development

With a focus on providing cost-effective and reliable solutions to accelerate manufacturing readiness of 3D technology options, SEMATECH experts reported new breakthroughs in wafer bonding at the 7th Annual Device Packaging Conference (DPC) on March 7-10 in Scottsdale, AZ. Technologists from SEMATECH’s 3D Interconnect program have demonstrated a novel die-to-wafer...