Matches for your search: "fan-out wafer level packaging "
October 2024 member news was marked by significant developments and milestones. From the grand openings of cutting-edge facilities that enhance production capabilities to impactful industry events fostering collaboration and engagement, our members have truly been at the forefront of progress. Additionally, new partnerships have emerged, driving innovation in technology and...
I usually leave this sort of commentary to Phil Garrou and Dean Freeman. But after a year of debate and revisions, the CHIPS and Science Act (Formerly the CHIPS Act), has made it to President Biden’s desk, and who knows, by the time you read this, he may have signed...
Plainview, N.Y., March 17, 2022—Veeco Instruments Inc. (NASDAQ: VECO) today announced that a world- leading semiconductor manufacturer has ordered multiple Veeco WaferStorm® Wet Processing Systems for advanced packaging applications. The systems were chosen due to the low cost of ownership advantage and process performance compared to other platforms. The customer...
Paper Titled ‘3D Inspection Is Becoming Essential in Advanced Packaging (AP)’ Minneapolis, Minnesota — November 29, 2021 — CyberOptics® Corporation (NASDAQ: CYBE), a leading global developer and manufacturer of high-precision 3D sensing technology solutions will share a technical presentation at the Heterogeneous Integration Global Summit organized by SEMICON Taiwan Dec...
October is a busy month as conferences go. ARM and Intel each held their virtual developer events focusing on the future of compute. IMAPS addressed packaging technology, and TSMC held its Open Innovation Platform (OIP) forum, also in late October. AMD followed up with an accelerated data center event in...
iNEMI recently presented a webinar by Prof. Madhavan Swaminathan who has taken over Georgia Tech’s Packaging Research Center, after Rao Tummala’s retirement. The topic of advanced packaging for 5G and the upcoming 6G is certainly of interest to all so let’s take a closer look. While 5G is expected to...
When people weren’t talking about the coronavirus at this year’s 2020 IMAPS Device Packaging Conference and its co-located Global Business Council, they were talking excitedly about the arrival of the golden age of packaging, heterogeneous integration, and most specifically, chiplet integration. Keynote speakers (Doug Yu, TSMC; Christian Hoffman, Qualcomm Germany;...
Several years before I started promoting 3D IC benefits in 2008, a small team of industry visionaries founded the 3D Architectures for Semiconductor Integration and Packaging conference (3D ASIP Conference). Rechristened to 3D Architectures for Heterogeneous Integration and Packaging (still 3D ASIP), each December sees several hundred key players from...
The embedded-die-in-substrate platform has its own history and adoption scheme compared to other advanced packaging platforms, explains Yole Développement (Yole). Indeed while the first significant volume of embedded die in integrated circuit (IC) package substrates came from direct current (DC) converters in smartphones, penetration in other market segments of interest...
In our last article, we talked about a project we participated in to test the feasibility of an assembly design kit (ADK) for package design verification. This time, we’d like to delve a little more into the reasons why assembly design kits are needed. Naturally, one of the reactions to...
