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Semi Analysis has detailed their thoughts on the current GPU shortage. We all know that AI technology is upon us. This will require massive amounts of GPU computing. Semi Analysis recently noted that GPU sales are skyrocketing and they see companies scrambling to stockpile inventory. For example, OpenAI is reporting...
Heterogenous integration in microelectronics requires advanced materials Tapei, Taiwan – September 12, 2022 – Brewer Science, Inc., a global leader in developing and manufacturing next-generation materials and processes for the microelectronics and optoelectronics industries, will present new developments in temporary and permanent bonding material technologies for advanced packaging at SEMICON...
Before I could start writing my blog post about the keynote talks delivered at the 2021 Virtual IMAPS Device Packaging Conference, I first had to find out what an XPU was. I’m often stymied by this industry’s penchant for acronyms and my journalistic need to write them out in the...
LITHOSCALE® incorporates EVG’s MLE™ (Maskless Exposure) technology to bring the benefits of digital lithography to a wide range of applications and markets EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the LITHOSCALE® maskless exposure system – the...
Two years ago, IMAPS tested the waters for a new conference focused entirely on system-in-packaging (SiP) technologies. They had also recently acquired the 3D Architectures for Semiconductor Integration and Packaging Conference (3DASIP), originally produced by RTI Tech Venture Forum, which took place annually in December in San Francisco. The IMAPS...
Key advanced packaging technology influencers came out in force to discuss the status of EDA tools for 2.5D/3D IC package design at the recent User to User (U2U 2019) Conference, organized by Mentor, A Siemens’ Business (Mentor) and hosted at the Santa Clara Marriott. Presenters from Wave Computing, ARM, Amkor,...
Grenoble, France (November 8, 2018)— UnitySC European leader and a key player in inspection and metrology solutions, today launched the Unity_LIGHTiX ™ system for micro/macro all surface inspection and 2D/3D metrology. This new inspection and metrology system has been designed to address multiple applications including redistribution layers (RDL) down to...
A couple of years ago we may not have predicted that in 2018 there would be a growing demand for high-end chips specifically for global cryptocurrency mining. Those taking part in this search for hashes have a glimmer in their eye similar to those consumed by the hope and frenzy...
Non-contact, non-destructive acoustic technology fulfills growing need in advanced packaging for thick film metrology up to 100μm and void detection down to 0.5μm Flanders, New Jersey (July 21, 2014)—Rudolph Technologies, Inc. (NYSE: RTEC) announced today the availability of its new SONUS™ Technology, designed for measuring thick films and film stacks...
Sometimes I get so caught up in following the progress of 3D IC with TSV that I lose sight of what else is going on in the 3D space.That is until something like STATS ChipPAC’s announcement that they are ramping to volume production with first-generation eWLB technology hits my inbox....
