Matches for your search: "fan-out wafer level packaging "
EVG S&R Mastering Shop™ further lowers barriers to adoption of nanoimprint lithography for wafer-level and panel-level production applications such as optical sensors, micro-lenses, nanophotonics and silicon photonics EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it...
Analysts are projecting strong growth in advanced packaging, with a compound annual growth rate (CAGR) through 2026 approaching 7% across the segment; much higher for certain high-end technologies, including 3D stacking, embedded die, and fan-out. Outsourced assembly and test (OSAT) firms, which package finished die manufactured by independent device manufacturers...
IME – Hybrid Bonding Studies Singapore’s Institute of Microelectronics – IME / AStar – was certainly the most prolific presenter at the conference. In their presentation, “Wafer Level Fine-Pitch Hybrid Bonding: Challenges and Remedies”, they review in great detail processing issues prevalent in hybrid bonding. Wafer-level fine-pitch hybrid bonding, first...
Having spent the last 30 years working in semiconductor manufacturing, it is both exciting and unsettling to see renewed political interest in the revitalization of this industry in the United States. Gone are the days of ‘It doesn’t make any difference whether a country makes computer chips or potato chips!’...
If TSMC’s Doug Yu wrote a rap song, the title would be “HIT IT!” He’s been on a roll lately, evangelizing heterogeneous integration technology (HIT) as the new path going forward for the semiconductor industry. In fact, the ECTC 2020 keynote is Yu’s third keynote presentation at key h this...
Let’s look at a few more presentations from the SEMI 3D & Systems Summit which was held in late January in Dresden. KLA showed this interesting schematic of where inspection was necessary for high-density 2.5/3D packaging. Embedded Chip Technology AT&S gave an interesting presentation on “Heterogeneous Module Integration using Embedded...
While Herb Reiter dove deep into the technology sessions at ECTC 2015, I spent most of my time picking the brains of suppliers who have introduced products targeting advanced wafer level packaging and 3D ICs. Overall, I’ve noticed efforts are becoming really targeted, and are focused on remaining challenges like thermal management, improving...
GRENOBLE, France – March 5, 2015 – IRT Nanoelec, an R&D consortium focused on ICT using micro- and nanoelectronics, and CMP, which provides prototyping and low-volume production of ICs and MEMS, are launching a platform for multi-project-wafer, post-process 3D integration (3D-MPW). The new and disruptive 3D configurations and assemblies created by...
Tokyo Electron Limited announced the completion of a definitive acquisition agreement with NEXX Systems Inc. Over the years, NEXX collaborated with TEL to study process technology in advanced packaging equipment for the development of 3D Thru Silicon Vias (TSV), giving both companies an opportunity to work together and setting the...
A walk across the impressive Bernin, France campus that is home to two of Soitec Group’s three divisions takes you past three production-level fab facilities – aptly named Bernin 1, Bernin 2, and Bernin 3, plus a development facility. The company’s three-stage business model encompasses innovation, licensing, and production...
