Matches for your search: "fan-out wafer level packaging "
IMAPS Reshoring Part 2: High-Density Build-Up Substrate Discussions Picking up where we left off in IFTLE 564, the second discussion session was supposed to be focused on the availability of high-density build-up substrates (HDBU) and where we stand in moving production onshore. Jan Vardaman of TechSearch International announced that a...
Last year (IFTLE 512) we discussed the SKC formation of the US subsidiary Absolics, and its glass core substrate manufacturing capabilities. In recent news, Applied Materials recently announced that it will acquire $39 million worth of Absolics shares. Absolics is issuing new shares to raise capital to expand its glass...
I usually leave this sort of commentary to Phil Garrou and Dean Freeman. But after a year of debate and revisions, the CHIPS and Science Act (Formerly the CHIPS Act), has made it to President Biden’s desk, and who knows, by the time you read this, he may have signed...
Plainview, N.Y., March 17, 2022—Veeco Instruments Inc. (NASDAQ: VECO) today announced that a world- leading semiconductor manufacturer has ordered multiple Veeco WaferStorm® Wet Processing Systems for advanced packaging applications. The systems were chosen due to the low cost of ownership advantage and process performance compared to other platforms. The customer...
Paper Titled ‘3D Inspection Is Becoming Essential in Advanced Packaging (AP)’ Minneapolis, Minnesota — November 29, 2021 — CyberOptics® Corporation (NASDAQ: CYBE), a leading global developer and manufacturer of high-precision 3D sensing technology solutions will share a technical presentation at the Heterogeneous Integration Global Summit organized by SEMICON Taiwan Dec...
UMC Becomes #3 Foundry TrendForce reports that UMC is expected to overtake GlobalFoundries as the world’s #3 foundry this quarter (4thQ 2020) reportedly driven by strong demand for display drivers and power management chips. UMC revenue will be US$1.57 billion, with a global market share of 6.9%, compared to GlobalFoundries’...
When people weren’t talking about the coronavirus at this year’s 2020 IMAPS Device Packaging Conference and its co-located Global Business Council, they were talking excitedly about the arrival of the golden age of packaging, heterogeneous integration, and most specifically, chiplet integration. Keynote speakers (Doug Yu, TSMC; Christian Hoffman, Qualcomm Germany;...
Several years before I started promoting 3D IC benefits in 2008, a small team of industry visionaries founded the 3D Architectures for Semiconductor Integration and Packaging conference (3D ASIP Conference). Rechristened to 3D Architectures for Heterogeneous Integration and Packaging (still 3D ASIP), each December sees several hundred key players from...
In our last article, we talked about a project we participated in to test the feasibility of an assembly design kit (ADK) for package design verification. This time, we’d like to delve a little more into the reasons why assembly design kits are needed. Naturally, one of the reactions to...
A 3D InCites reader recently inquired whether cost drivers and fine-pitch requirements in 3D applications are moving manufacturers away from flux towards fluxless processes in the bumping steps for both bump formation and assembly.To answer this question, 3D InCites turned to the materials and equipment experts, speaking with Jeff Calvert,...
