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EMIB

Cadence and Intel Foundry Collaborate to Enable Heterogeneous Integration with EMIB Packaging Technology

Cadence and Intel Foundry have collaborated to develop and certify an integrated advanced packaging flow utilizing Embedded Multi-die Interconnect Bridge (EMIB) technology to address the growing complexity in heterogeneously integrated multi-chip(let) architectures. The collaboration enables Intel customers to leverage advanced packaging to accelerate the high-performance computing (HPC), AI, and mobile...

hybrid bonding

The Age of Hybrid Bonding: Where We Are and Where We’re Going

For decades, Moore’s Law has been a way to measure performance gains in the semiconductor industry, but the ability to double the density of transistors on a chip every two years is becoming increasingly challenging. With scaling reaching its limit, manufacturers are looking to advanced packaging innovations to extend the...

Glass Carrier for GaAs Wafer Processing

Gallium arsenide (GaAs) is used in the manufacture of devices such as microwave frequency integrated circuits, monolithic microwave integrated circuits, infrared light-emitting diodes, laser diodes, solar cells, and optical windows. Handling and processing thin GaAs wafers is usually enabled by using a sapphire wafer as a carrier, which is expensive...

IFTLE 475: EPTC 2020: IME on Hybrid Bonding Challenges; Latest on Intel

IME – Hybrid Bonding Studies Singapore’s Institute of Microelectronics – IME / AStar – was certainly the most prolific presenter at the conference. In their presentation, “Wafer Level Fine-Pitch Hybrid Bonding: Challenges and Remedies”, they review in great detail processing issues prevalent in hybrid bonding. Wafer-level fine-pitch hybrid bonding, first...

Carrier Wafers for Semiconductor and MEMS Manufacturing

As technology rapidly moves forward, the reduction of device and chip size is playing an important role in implementing as many chips and sensors in the smallest space. For this reason, the thickness reduction of semiconductor wafers is necessary. Thin semiconductor wafers (thickness around 50-100 µm) are flexible and fragile....

How to Create a Vibrant Semiconductor Manufacturing Industry in the United States

Having spent the last 30 years working in semiconductor manufacturing, it is both exciting and unsettling to see renewed political interest in the revitalization of this industry in the United States. Gone are the days of ‘It doesn’t make any difference whether a country makes computer chips or potato chips!’...

Rudolph Technologies and DISCO Corporation Partner to Improve Wafer Saw Process

Flanders, New Jersey (July 14, 2015)—Rudolph Technologies, Inc. (NYSE: RTEC) and DISCO Corporation of Tokyo, Japan, announce a collaborative partnership to deliver leading-edge hardware and software solutions to optimize the wafer saw unit processes. These comprehensive solutions will enable their customers to consistently improve the quality and productivity of their...

NEXX Systems Joins Tokyo Electron (TEL) as a Wholly Owned Subsidiary

Tokyo Electron Limited announced the completion of a definitive acquisition agreement with NEXX Systems Inc. Over the years, NEXX collaborated with TEL to study process technology in advanced packaging equipment for the development of 3D Thru Silicon Vias (TSV), giving both companies an opportunity to work together and setting the...

SEMATECH Reports Advances in Bond Process for 3D Integration Development

With a focus on providing cost-effective and reliable solutions to accelerate manufacturing readiness of 3D technology options, SEMATECH experts reported new breakthroughs in wafer bonding at the 7th Annual Device Packaging Conference (DPC) on March 7-10 in Scottsdale, AZ. Technologists from SEMATECH’s 3D Interconnect program have demonstrated a novel die-to-wafer...