Matches for your search: "fan-out wafer level packaging "
EVG S&R Mastering Shop™ further lowers barriers to adoption of nanoimprint lithography for wafer-level and panel-level production applications such as optical sensors, micro-lenses, nanophotonics and silicon photonics EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it...
Analysts are projecting strong growth in advanced packaging, with a compound annual growth rate (CAGR) through 2026 approaching 7% across the segment; much higher for certain high-end technologies, including 3D stacking, embedded die, and fan-out. Outsourced assembly and test (OSAT) firms, which package finished die manufactured by independent device manufacturers...
If TSMC’s Doug Yu wrote a rap song, the title would be “HIT IT!” He’s been on a roll lately, evangelizing heterogeneous integration technology (HIT) as the new path going forward for the semiconductor industry. In fact, the ECTC 2020 keynote is Yu’s third keynote presentation at key h this...
Let’s look at a few more presentations from the SEMI 3D & Systems Summit which was held in late January in Dresden. KLA showed this interesting schematic of where inspection was necessary for high-density 2.5/3D packaging. Embedded Chip Technology AT&S gave an interesting presentation on “Heterogeneous Module Integration using Embedded...
The Microelectronics Packaging and Test Engineering Council (MEPTEC) held its annual heterogeneous integration symposium at SEMI’s headquarters in Milpitas, CA on December 5, 2018. Many manufacturing and test, as well as electronic design automation (EDA) and IC design experts, got together to present and discuss how to integrate heterogeneous functions...
Every year at SEMICON West, in addition to taking in keynotes and technology sessions, I like to catch up with semiconductor suppliers to find out about any significant news, their latest offerings and how they are enabling next-generation manufacturing. Here are this year’s highlights. UnitySC One of the big stories...
While Herb Reiter dove deep into the technology sessions at ECTC 2015, I spent most of my time picking the brains of suppliers who have introduced products targeting advanced wafer level packaging and 3D ICs. Overall, I’ve noticed efforts are becoming really targeted, and are focused on remaining challenges like thermal management, improving...
GRENOBLE, France – March 5, 2015 – IRT Nanoelec, an R&D consortium focused on ICT using micro- and nanoelectronics, and CMP, which provides prototyping and low-volume production of ICs and MEMS, are launching a platform for multi-project-wafer, post-process 3D integration (3D-MPW). The new and disruptive 3D configurations and assemblies created by...
A walk across the impressive Bernin, France campus that is home to two of Soitec Group’s three divisions takes you past three production-level fab facilities – aptly named Bernin 1, Bernin 2, and Bernin 3, plus a development facility. The company’s three-stage business model encompasses innovation, licensing, and production...
Device of the Year Amkor Technologies, Inc: SWIFT SWIFT: uniquely developed to deliver a high yielding, high-performance package with the thinnest profile in the industry. This package can deliver 2um line/space lithography with up to 4 layers of RDL and a very dense network of memory interface vias from bottom...
