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The Microelectronics Packaging and Test Engineering Council (MEPTEC) held its annual heterogeneous integration symposium at SEMI’s headquarters in Milpitas, CA on December 5, 2018. Many manufacturing and test, as well as electronic design automation (EDA) and IC design experts, got together to present and discuss how to integrate heterogeneous functions...
Through-silicon vias (TSVs) have been firmly established as a method of interconnect that enables high bandwidth and low latency between dies at extremely low power dissipation. Used for years in microelectromechanical systems (MEMS), compound semiconductors, and image sensors, TSVs are now also in mainstream production for 2.5D interposer technologies, and...
Did you get your ECTC Advanced Program and Registration in the mail yet? Mine arrived yesterday, and I was pleased to see that this year’s Electronics Components and Technologies Conference (ECTC 2018), which takes place May 29-June 1, will be all about the new technology darlings driving development in heterogeneous...
As it has for the past 14 years, the global microelectronics industry gathered at Wekopa Resort and Conference Center in Fountain Hills, AZ, March 6-8, 2018, for the 2018 IMAPS Device Packaging Conference (DPC) to share knowledge, discuss strategies for growth, learn about the latest heterogeneous integration from fan-out wafer...
It’s that time of year again! With SEMICON West just over 2 short months away, we’re ready to launch the 2017 3D InCites Awards. The 2017 3D InCites Awards will be presented on Wednesday, July 12, 2017, during SEMICON West, in a ceremony at the Impress Lounge, (located above Moscone...
Wilmington, Mass. (May 1, 2017) Rudolph Technologies, Inc. (NYSE: RTEC) announced today that two of the industry’s leading suppliers of advanced packaging services have purchased multiple Firefly™ Inspection Systems. The Firefly System, with Rudolph’s patented Clearfind™ Technology, can detect defects that are almost impossible to find using conventional imaging techniques...
Remember back a few years ago when 3D and TSV were considered to be the pretty much the same thing? Anne-Marie Dutron, general director of SEMI Europe Grenoble Office does. She was in the thick of it, working at ST Microelectronics Mobile Division in partnership with CEA-Leti and imec on...
Here’s one thing the team at Rudolph has a firm grasp on: understanding that feature sizes of today’s wafer-level, 2.5D and 3D packaging technologies are changing the requirements for manufacturing tools in the back-end, and in many cases the back-end tools of today are starting to resemble the front-end tools...
Semiconductor equipment manfacturer, SPP Process Technology Systems (SPTS) announced that it has shipped a 300mm Sigma® fxPTM PVD system and a 300mm RVP300 furnace
Device of the Year Amkor Technologies, Inc: SWIFT SWIFT: uniquely developed to deliver a high yielding, high-performance package with the thinnest profile in the industry. This package can deliver 2um line/space lithography with up to 4 layers of RDL and a very dense network of memory interface vias from bottom...
