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Amkor Technology and TSMC announced today that the two companies have signed a memorandum of understanding to collaborate and bring advanced packaging and test capabilities to Arizona, further expanding the region’s semiconductor ecosystem. Amkor and TSMC have been closely collaborating to deliver high-volume, leading-edge technologies for advanced packaging and testing of semiconductors to...
IMAPS CHIPCon conference was held at the end of July 2023. CHIPcon was created to focus on chiplets and Heterogeneous Integration. The 2023 CHIPcon was held in San Jose and was led by General Chair Steven Kummerl from Texas Instruments. Samsung AVP Let’s first take a look at the Samsung...
At the recent IMAPS virtual/live hybrid meeting from San Diego, I was most interested in the workshop run by Fraunhofer IZM on what 6G telecom means for Advanced Packaging. Let’s take a closer look at the presentation by Ivan Ndip . 5G appears in multiple forms (Figure 1) Breakthrough 5G...
The World is Dangerously Dependent on Taiwan for Chips The Taipai Times recently published this position paper (written by reporters from Bloomberg) making the point that Taiwan could become the flashpoint between China and the West due to their position in the world economy driven by their chip manufacturing capabilities....
Building on their previous announcements of its embedded interconnect bridge, EMIB, ( see IFTLE 324 “Intel EMIB Implementation in the Stratix MX”) and Foveros technologies (see IFTLE 400 “Intel Logic-Logic 3DIC and Chiplets are Finally Here”), Intel, as a prequel to SEMICON West this year, hosted a media/analyst event to...
Substrate-like PCBs (SLP) is a term describing a high-density printed circuit board (PCB) that has feature sizes close to that of an IC substrate. The main difference between a PCB and an IC substrate is the feature sizes, especially line and space (L/S). SLP requires line width/line spacing equal to...
At the recent IMAPS Device Packaging Conference in Fountain Hills, AZ. Kyung Suk (Dan) Oh, Package Development VP at Samsung, discussed “Electronics Packaging Technologies for the 4th Industrial Revolution” Oh explained that Samsung sees today’s technology paradigm shift as going “beyond Moore” by a convergence of system integration/packaging and software....
Last week at IWLPC, keynote speaker, Doug Yu, TSMC, kicked off the event with a similar storyline used by ASE’s Tien Wu during his IMAPS Symposium keynote earlier this month: High-performance applications like artificial intelligence (AI), 5G, autonomous driving, and even high-end smartphones are driving the continuation of Moore’s Law...
Mobile devices, specifically smartphones, represent the single greatest volume driver for MEMS and other sensors today. Sensors found in these products include electronic compasses, motion sensors, barometers, microphones, and fingerprint sensors. Package types include land grid arrays (LGAs), lead frame packages such as QFNs, and wafer level packages (WLPs.). Apple...
Part three of a five-part series In the first two parts of this series, we focused on low-cost flip chip and wafer-level chip scale packages (WLCSP), identifying them as two advanced packaging platforms we consider to be among the “Big Five.” It is our belief at Amkor that convergence into...
