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MUNICH, February 6th, 2024 – ERS electronic, the industry leader in the market of thermal management solutions for semiconductor manufacturing, is pleased to announce that Debbie-Claire Sanchez has been appointed Vice President with immediate effect. Debbie joined ERS in 2019 as Strategic Product Manager for the company’s Fan-out Business Unit,...
The World is Dangerously Dependent on Taiwan for Chips The Taipai Times recently published this position paper (written by reporters from Bloomberg) making the point that Taiwan could become the flashpoint between China and the West due to their position in the world economy driven by their chip manufacturing capabilities....
Analysts are projecting strong growth in advanced packaging, with a compound annual growth rate (CAGR) through 2026 approaching 7% across the segment; much higher for certain high-end technologies, including 3D stacking, embedded die, and fan-out. Outsourced assembly and test (OSAT) firms, which package finished die manufactured by independent device manufacturers...
If TSMC’s Doug Yu wrote a rap song, the title would be “HIT IT!” He’s been on a roll lately, evangelizing heterogeneous integration technology (HIT) as the new path going forward for the semiconductor industry. In fact, the ECTC 2020 keynote is Yu’s third keynote presentation at key h this...
Let’s look at a few more presentations from the SEMI 3D & Systems Summit which was held in late January in Dresden. KLA showed this interesting schematic of where inspection was necessary for high-density 2.5/3D packaging. Embedded Chip Technology AT&S gave an interesting presentation on “Heterogeneous Module Integration using Embedded...
“2.5D and 3D stacking technologies are the only solution that meet the required performance of applications like AI[1] and datacenter as for today”, confirms Mario Ibrahim, Technology & Market Analyst from Yole Développement (Yole). Stacking technologies are used in a variety of hardware, including 3D stacked memory, GPU[2], FPGA[3], and...
The Microelectronics Packaging and Test Engineering Council (MEPTEC) held its annual heterogeneous integration symposium at SEMI’s headquarters in Milpitas, CA on December 5, 2018. Many manufacturing and test, as well as electronic design automation (EDA) and IC design experts, got together to present and discuss how to integrate heterogeneous functions...
Every year at SEMICON West, in addition to taking in keynotes and technology sessions, I like to catch up with semiconductor suppliers to find out about any significant news, their latest offerings and how they are enabling next-generation manufacturing. Here are this year’s highlights. UnitySC One of the big stories...
Semiconductor equipment manfacturer, SPP Process Technology Systems (SPTS) announced that it has shipped a 300mm Sigma® fxPTM PVD system and a 300mm RVP300 furnace
Device of the Year Amkor Technologies, Inc: SWIFT SWIFT: uniquely developed to deliver a high yielding, high-performance package with the thinnest profile in the industry. This package can deliver 2um line/space lithography with up to 4 layers of RDL and a very dense network of memory interface vias from bottom...
