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ACM Research, Inc., a leading supplier of wafer processing solutions for semiconductor and advanced packaging applications, announced its Single-Wafer High-Temperature Sulfuric Peroxide Mixture (SPM) tool has been qualified by a key logic device manufacturer in mainland China. To date, ACM has delivered its SPM tools to 13 customers. The system...
Welcome to our new monthly community member news in review where we will highlight community news, events, milestones, anything worth sharing from the month previous. If we missed you this month, be sure to add us to your distribution list, we don’t want to leave anyone out. Our community members...
The IEEE 3DIC Conference was held at North Carolina State University in Raleigh NC in person from Nov 15-18 2021. The Conference Chair was Paul Franzon. Let’s take a look at some of the key presentations. CEA Leti – Copper Hybrid Bonding for GaN on Silicon Dubarry of Leti presented...
Like every other awards event in the past year, the 2021 3D InCites Awards Program had to make some adjustments for celebrating its winners. We can’t gather in person at the IMAPS Device Packaging Conference to applaud the winners, catch up with colleagues over a great barbeque, watch the 3D...
Almost four years ago, we published an article titled “CoolCube™: A True 3DVLSI Alternative to Scaling” on 3D InCites. It described the concept of stacking layers of transistors sequentially on top of each other and documented the research effort happening at Leti to develop a feasible process integration scheme and...
More than 80 companies are developing autonomous vehicles and many more are involved in providing sensors and computational systems for advanced driver assistance systems (ADAS). System design, package choices, materials, and process integration are critical to the successful implementation of the new safety features that are part of ADAS and...
In July and August schools are closed and many people like to take vacation. Typically nothing major happens during these months. Not this year! It was a lively August, if you consider the recent “adjustments” in the stock markets worldwide as a series of events disrupting the summer doldrums. But...
ST. FLORIAN, Austria, July 30, 2015—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has received a 2015 3D InCites Award for its GEMINI®FB XT automated fusion wafer bonder in the category of 3D manufacturing equipment....
Two years ago, I visited EV Group’s world headquarters in Schärding, Austria, and wrote about what they call their Triple I approach to success. Triple I stands for Invent, Innovate, Implement, and refers to EVG’s mission of getting into whatever market they target at the ground level, investing 20% of...
Earlier this week, Mitsubishi Heavy Industries, Ltd. announced it had “developed the world's first fully automated 12-inch (300 millimeters) wafer bonding machine, capable of producing 3-dimensionally integrated LSI (large-scale integration) circuits at room temperature.” This tool is targeted to the MEMS, 3D LSI's, and the RF market. I was skeptical...
