Matches for your search: "fan-out wafer level packaging "
The growing demand for semiconductors, from the cloud to the edge, from artificial intelligence (AI) to 5G communications, has exceeded the capabilities of traditional silicon scaling. In the “More than Moore” era, performance requirements for leading-edge semiconductor devices demand extremely fine pitch (<10µm, or even <1µm) interconnection in semiconductor packaging...
Santee, Calif. – 7 March 2024 – StratEdge Corporation, leader in the design, production, and assembly of high-performance semiconductor packages for demanding applications, today announced it will showcase its latest package manufacturing innovations at the IMAPS Device Packaging Conference in Fountain Hills, Arizona, March 19-20, 2024. StratEdge’s molded ceramic semiconductor...
The 72nd IEEE Electronic Components and Technology Conference (ECTC) took place at the end of May in San Diego CA. We all know by now that ECTC is the premier microelectronic packaging conference in the world. While I was not able to attend in person, it was NOT due to...
After two years of virtual conferences, it was great to be back in person last week at the 2022 IMAPS Device Packaging Conference (IMAPS DPC). With over 400 attendees, it felt like the good old days. While it wasn’t the first in-person conference we’d attended; it did feel more like...
Last year at ECTC 2019, Xperi officially launched DBI Ultra™; the die-to-wafer hybrid bonding version of the highly successful, wafer-to-wafer DBI. Excited to celebrate this momentous occasion with them, I even wore the Xperi logo for the photo. Here we are a year later, and although I won’t have the...
Whoa! Where did the time go? ECTC 2019 is only three weeks away and I haven’t written my annual preview post! This year’s event takes place at the Cosmopolitan in Las Vegas, from May 28-31. I’m excited to announce that my good friend and SemiSister, Nancy Stoffel, General Electric Research...
Silicon Carbide (SiC) is a wide bandgap (WBG) material that has advantages when compared to silicon (Figure 1). For the same die size and thickness, WBG devices provide higher breakdown voltage, current, operating temperature, and switching speed; and lower switching loss over Si devices. ST Microelectronics (ST Micro) started working...
Flanders, New Jersey (November 2, 2015)—Rudolph Technologies, Inc. (NYSE: RTEC) announced today that it has received a multi-fab order for its Discover® Enterprise Yield Management System (YMS) software from one of the world’s top three-dimensional (3D) memory device makers. Discover YMS software is a leading yield management solution, traditionally used in front-end...
Saratoga Springs, NY, rolled out the red carpet the week of 19 May 2014 for the 320+ attendees, speakers, panelists, and journalists who participated in the 25th Annual SEMI Advanced Semiconductor Manufacturing Conference. Conference co-chairs Israel Ne’eman, Applied Material, and Oliver Patterson, IBM Microelectronics, presided over a group of talented...
Earlier this week, Mitsubishi Heavy Industries, Ltd. announced it had “developed the world's first fully automated 12-inch (300 millimeters) wafer bonding machine, capable of producing 3-dimensionally integrated LSI (large-scale integration) circuits at room temperature.” This tool is targeted to the MEMS, 3D LSI's, and the RF market. I was skeptical...
