Matches for your search: "fan-out wafer level packaging "
Santee, Calif. – 7 March 2024 – StratEdge Corporation, leader in the design, production, and assembly of high-performance semiconductor packages for demanding applications, today announced it will showcase its latest package manufacturing innovations at the IMAPS Device Packaging Conference in Fountain Hills, Arizona, March 19-20, 2024. StratEdge’s molded ceramic semiconductor...
IMAPS CHIPCon conference was held at the end of July 2023. CHIPcon was created to focus on chiplets and Heterogeneous Integration. The 2023 CHIPcon was held in San Jose and was led by General Chair Steven Kummerl from Texas Instruments. Samsung AVP Let’s first take a look at the Samsung...
After two years of virtual conferences, it was great to be back in person last week at the 2022 IMAPS Device Packaging Conference (IMAPS DPC). With over 400 attendees, it felt like the good old days. While it wasn’t the first in-person conference we’d attended; it did feel more like...
At the recent IMAPS virtual/live hybrid meeting from San Diego, I was most interested in the workshop run by Fraunhofer IZM on what 6G telecom means for Advanced Packaging. Let’s take a closer look at the presentation by Ivan Ndip . 5G appears in multiple forms (Figure 1) Breakthrough 5G...
Building on their previous announcements of its embedded interconnect bridge, EMIB, ( see IFTLE 324 “Intel EMIB Implementation in the Stratix MX”) and Foveros technologies (see IFTLE 400 “Intel Logic-Logic 3DIC and Chiplets are Finally Here”), Intel, as a prequel to SEMICON West this year, hosted a media/analyst event to...
Substrate-like PCBs (SLP) is a term describing a high-density printed circuit board (PCB) that has feature sizes close to that of an IC substrate. The main difference between a PCB and an IC substrate is the feature sizes, especially line and space (L/S). SLP requires line width/line spacing equal to...
Whoa! Where did the time go? ECTC 2019 is only three weeks away and I haven’t written my annual preview post! This year’s event takes place at the Cosmopolitan in Las Vegas, from May 28-31. I’m excited to announce that my good friend and SemiSister, Nancy Stoffel, General Electric Research...
At the recent IMAPS Device Packaging Conference in Fountain Hills, AZ. Kyung Suk (Dan) Oh, Package Development VP at Samsung, discussed “Electronics Packaging Technologies for the 4th Industrial Revolution” Oh explained that Samsung sees today’s technology paradigm shift as going “beyond Moore” by a convergence of system integration/packaging and software....
Silicon Carbide (SiC) is a wide bandgap (WBG) material that has advantages when compared to silicon (Figure 1). For the same die size and thickness, WBG devices provide higher breakdown voltage, current, operating temperature, and switching speed; and lower switching loss over Si devices. ST Microelectronics (ST Micro) started working...
Flanders, New Jersey (November 2, 2015)—Rudolph Technologies, Inc. (NYSE: RTEC) announced today that it has received a multi-fab order for its Discover® Enterprise Yield Management System (YMS) software from one of the world’s top three-dimensional (3D) memory device makers. Discover YMS software is a leading yield management solution, traditionally used in front-end...
