Matches for your search: "fan-out wafer level packaging "
Heterogenous integration and AI are currently moving forward hand-in-hand as the demand for greater computing power in theory, reduces the energy and time needed to train models; (although, DeepSeek may now change some of the thinking along these lines). Larger more complex packages are being built to manage the learning...
This interview with Trymax Semiconductor’s Peter Dijkstra, Chief Commercial Officer (CCO), and Karsten Arts, Process Engineer first appeared in Atomic Limits as part of a series of posts about companies within the atomic scale processing industry. The goal of the series was to provide information about the kind of products...
Preparation for the 73rd ECTC started one year ago and was strongly supported by over 250 experts from 15 countries, members of 10 technical committees. The technical committees critically reviewed 618 submitted abstracts from industry (56.1%) and academia (43.9%), resulting in 369 technical papers. The papers, organized in 41 sessions,...
Continuing our look at key Hybrid Bonding (HB) papers at the recent ECTC 2022 in San Diego, CA. Applied Materials Hybrid bonding requires a lot of front-end processing tools, thus you can expect Applied Materials (AMAT) to be an entrant in this technology. In its paper “A Holistic Development Platform...
A number of research articles have been published over the past several years showing the advantages glass-based solutions can bring to packaging and systems integration including radio frequency (RF) front-end devices, interposers, MEMs devices, and integrated photonics. In particular, RF applications for glass are gaining interest for use as a...
The performance and productivity of microelectronics have increased continuously over the last 50 years due to the enormous advances in lithography and device technology. Today, these technologies are becoming prevalent in 3D packaging, which further enables advances in integrating various technologies (logic, memory, RF, sensors, etc.) in a small form...
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it is demonstrating optimized pre-processing solutions for the implementation of plasma dicing for advanced semiconductor packaging applications. EVG’s latest products and process development services support this emerging semiconductor back-end...
A little over a year ago, I wrote a Knowledge Portal entry about the cost of 3D ICs. Here I am again to tackle the issue of 2.5D and 3D cost reduction from a slightly different angle. This entry is based on what SavanSys presented at IMAPS Device Packaging 2016....
Demand For Flexible, High-Volume Manufacturing Solutions in 3D-IC/Advanced Packaging, MEMS, Power Device and Compound Semiconductor Markets Drive Growth SEMICON WEST, San Francisco, July 9, 2013— EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has achieved...
Enabling Commercialization of Groundbreaking Temporary Bonding and Debonding Technology ROLLA, MO, USA and st. florian, AUSTRIA, October 20, 2011 – Brewer Science, Inc., a global leading innovator and manufacturer of specialty materials, process solutions, and equipment for the microelectronics industry, and EV Group (EVG), a leading supplier of wafer bonding...
