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Welcome to our new monthly community member news in review where we will highlight community news, events, milestones, anything worth sharing from the month previous. If we missed you this month, be sure to add us to your distribution list, we don’t want to leave anyone out. Our community members...
The IEEE 3DIC Conference was held at North Carolina State University in Raleigh NC in person from Nov 15-18 2021. The Conference Chair was Paul Franzon. Let’s take a look at some of the key presentations. CEA Leti – Copper Hybrid Bonding for GaN on Silicon Dubarry of Leti presented...
Veeco Instruments Inc. (NASDAQ: VECO) announced that a world leader in semiconductor assembly and testing has placed a multi-system order for its AP300™ Lithography System for the production ramp of advanced packaging chips. The advanced packaging devices will be used to meet increasing demand for 5G system-on-a-chip, graphic processors (GPUs)...
Like every other awards event in the past year, the 2021 3D InCites Awards Program had to make some adjustments for celebrating its winners. We can’t gather in person at the IMAPS Device Packaging Conference to applaud the winners, catch up with colleagues over a great barbeque, watch the 3D...
Almost four years ago, we published an article titled “CoolCube™: A True 3DVLSI Alternative to Scaling” on 3D InCites. It described the concept of stacking layers of transistors sequentially on top of each other and documented the research effort happening at Leti to develop a feasible process integration scheme and...
More than 80 companies are developing autonomous vehicles and many more are involved in providing sensors and computational systems for advanced driver assistance systems (ADAS). System design, package choices, materials, and process integration are critical to the successful implementation of the new safety features that are part of ADAS and...
A novel copper interconnection technology is being pioneered by Georgia Tech’s Packaging Research Center (GT-PRC) to achieve manufacturable solder-free assembly at low temperatures. By interfacing engineering and process design, the Cu interconnections are shown to meet both thermal cycling and ultra-high current-handling needs. This technology is now being applied to mobile...
Here’s one thing the team at Rudolph has a firm grasp on: understanding that feature sizes of today’s wafer-level, 2.5D and 3D packaging technologies are changing the requirements for manufacturing tools in the back-end, and in many cases the back-end tools of today are starting to resemble the front-end tools...
I didn’t make it to the SEMICON Taiwan SiP Global Summit this year and was hoping to find some coverage by other journalists so that I could at least curate and share the information on the 3D IC Technology Forum. Unfortunately, I didn’t see anything posted on the topic, but...
Two years ago, I visited EV Group’s world headquarters in Schärding, Austria, and wrote about what they call their Triple I approach to success. Triple I stands for Invent, Innovate, Implement, and refers to EVG’s mission of getting into whatever market they target at the ground level, investing 20% of...
